Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MVF60NN152CMK40MVF60NN152CMK40NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
1,332
MVF60NN152CMK50MVF60NN152CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
660
MVF60NS151CMK40MVF60NS151CMK40NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
613
MVF60NS151CMK50MVF60NS151CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
1,009
MVF60NS152CMK40MVF60NS152CMK40NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
697
MVF60NS152CMK50MVF60NS152CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
478
MVF61NN151CMK50MVF61NN151CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
537
MVF61NN152CMK50MVF61NN152CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
414
MVF61NS151CMK50MVF61NS151CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
260
MVF61NS152CMK50MVF61NS152CMK50NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
131
MVF62NN151CMK4MVF62NN151CMK4NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
1,280
MVF62NN151CMK40MVF62NN151CMK40NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
671
N/AMVF62NN152CMK4NXP SemiconductorsIC MCU 32BIT ROMLESS 364MAPBGAMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5/M4
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, WDT
Program Memory Type:
ROMless
RAM Size:
1.5MB
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D Dual x 12b; D/A Dual x 12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
650
MVF62NN152CMK40N/AMVF62NN152CMK40NXP SemiconductorsIC MPU VYBRID 167MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 167MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
197
MX7507JNMX7507JNAnalog Devices Inc.IC MUX DUAL 8:1 450MOHM 28DIPAnalog Switches, Multiplexers, Demultiplexers28-PDIPN/A0°C ~ 70°C
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
450mOhm
Channel-to-Channel Matching (ΔRon):
18Ohm
Voltage – Supply, Single (V+):
±4.5V ~ 18V
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
800ns, 800ns (Typ)
Channel Capacitance (CS(off), CD(off)):
5pF, 20pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
28-DIP (0.300″”, 7.62mm)
Supplier Device Package:
28-PDIP
664
MXL1535ECWIMXL1535ECWIAnalog Devices Inc.IC TRANSCEIVER FULL 1/1 28SOICDrivers, Receivers, Transceivers28-SOIC3V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
30 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width), 16 Leads
Supplier Device Package:
28-SOIC
1,132
MXL1535ECWI+MXL1535ECWI+Analog Devices Inc.IC TRANSCEIVER FULL 1/1 28SOICDrivers, Receivers, Transceivers28-SOIC3V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
30 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width), 16 Leads
Supplier Device Package:
28-SOIC
47
MXL1535ECWI+TMXL1535ECWI+TAnalog Devices Inc.IC TRANSCEIVER FULL 1/1 28SOICDrivers, Receivers, Transceivers28-SOIC3V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
30 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width), 16 Leads
Supplier Device Package:
28-SOIC
862
MXL1535EEWIMXL1535EEWIAnalog Devices Inc.IC TRANSCEIVER FULL 1/1 28SOICDrivers, Receivers, Transceivers28-SOIC3V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
30 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width), 16 Leads
Supplier Device Package:
28-SOIC
525
MXL1535EEWI+MXL1535EEWI+Analog Devices Inc.IC TRANSCEIVER FULL 1/1 28SOICDrivers, Receivers, Transceivers28-SOIC3V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
30 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SOIC (0.295″”, 7.50mm Width), 16 Leads
Supplier Device Package:
28-SOIC
596

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