 | | R7S721010VCFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LQFP (28×28) | 311 | |
 | | R7S721010VLFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LQFP (28×28) | 1,377 | |
 | | R7S721011VCBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 318 | |
 | | R7S721011VLBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 434 | |
 | | R7S721020VCBG#AC1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFBGA | Microprocessors | 176-LFBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (8×8) | 225 | |
 | | R7S721020VCFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFQFP (24×24) | 37 | |
 | N/A | R7S721020VLFP#AA0 | Renesas | IC MPU RZ/A1L 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFQFP (24×24) | 684 | |
 | | R7S721020VLFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFQFP (24×24) | 218 | |
 | | R7S721021VCFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 208LFQFP | Microprocessors | 208-LFQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFQFP (28×28) | 816 | |
 | | R7S721021VLFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 208LFQFP | Microprocessors | 208-LFQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFQFP (28×28) | 1,043 | |
 | | R7S721030VCBG#AC0 | Renesas | IC MPU RZ/A1LU 400MHZ 176LFBGA | Microprocessors | 176-LFBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (8×8) | 346 | |
 | | R7S721030VCFP#AA0 | Renesas | IC MPU RZ/A1LU 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFQFP (24×24) | 516 | |
 | N/A | R7S721030VLFP#AA0 | Renesas | IC MPU RZ/A1LU 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFQFP (24×24) | 59 | |
 | | R7S721031VCBG#AC0 | Renesas | IC MPU RZ/A1LU 400MHZ 233FBGA | Microprocessors | 233-FBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 233-FBGA (15×15) | 848 | |
 | | R7S721031VCFP#AA0 | Renesas | IC MPU RZ/A1LU 400MHZ 208LFQFP | Microprocessors | 208-LFQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps (1), 100Mbps (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFQFP (28×28) | 1,132 | |
 | | R7S721034VCBG#AC0 | Renesas | IC MPU RZ/A1LC 400MHZ 176LFBGA | Microprocessors | 176-LFBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (8×8) | 286 | |
 | | R7S910001CFP#AA0 | Renesas | IC MCU 32BIT ROMLESS 176HLQFP | Microcontrollers | 176-HLQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 397 | |
 | | R7S910002CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 14 | |
 | | R7S910002CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,030 | |
 | | R7S910006CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 309 | |