 | | RM48L940PGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 756 | |
 | | RM48L940ZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,402 | |
 | | RM48L950DPGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,812 | |
 | | RM48L950DZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 175 | |
 | | RM48L950PGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,746 | |
 | | RM48L950ZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,966 | |
 | | RM48L952DPGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 284 | |
 | | RM48L952DZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 23 | |
 | | RM48L952PGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 209 | |
 | | RM48L952ZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 919 | |
| N/A | N/A | RM5231A-350P-B002 | Microchip Technology | IC MPU 350MHZ | Microprocessors | - | N/A | – | Number of Cores/Bus Width: 1 Core, 64-Bit Additional Interfaces: PCI | 1,180 | |
 | | RM57L843BZWTT | Texas Instruments | IC MCU 16/32B 4MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 57×10/12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 702 | |
| N/A | | RM7035C-466L-D004 | Renesas | 64-Bit MIPS RISC Microprocessors | Microprocessors | N/A | N/A | N/A | N/A | 710 | |
| N/A | N/A | RM7035C-600L-D004 | Microchip Technology | IC MPU 600MHZ | Microprocessors | N/A | N/A | – | Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR, SDRAM Additional Interfaces: PCI | 680 | |
| N/A | N/A | RM7065C-466G-D004 | Microchip Technology | IC MPU 466MHZ | Microprocessors | N/A | N/A | – | Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR, SDRAM Additional Interfaces: PCI | 128 | |
| N/A | N/A | RM7065C-600G-D004 | Microchip Technology | IC MPU 600MHZ | Microprocessors | N/A | N/A | – | Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR, SDRAM Additional Interfaces: PCI | 1,004 | |
 | | RN-SRL-FTD5V-DGL | Microchip Technology | IC CONTROLLER USB MODULE | Controllers | Module | 5V | -40°C ~ 85°C | Function: Bridge, USB to UART Operating Temperature: -40°C ~ 85°C Supplier Device Package: Module | 505 | |
 | | RN-SRL-PRO3V-DGL | Microchip Technology | IC CONTROLLER USB MODULE | Controllers | Module | 3.3V | -40°C ~ 85°C | Function: Bridge, USB to UART Operating Temperature: -40°C ~ 85°C Supplier Device Package: Module | 483 | |
| N/A | | RN80532KC041512 | Intel | IC MPU INTEL XEON 2GHZ 603MPGA | Microprocessors | 603-mPGA (53.34x53.34) | N/A | 70°C (TC) | Core Processor: Intel® Xeon® Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 70°C (TC) Mounting Type: Through Hole Package / Case: 603-BFCPGA Supplier Device Package: 603-mPGA (53.34×53.34) | 123 | |
| N/A | | RN80532KC056512 | Intel | IC MPU INTEL XEON 2.4GHZ 603PPGA | Microprocessors | 603-PPGA | N/A | 74°C (TC) | Core Processor: Intel® Xeon® Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 74°C (TC) Mounting Type: Through Hole Supplier Device Package: 603-PPGA | 583 | |