 | | R7S910025CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,823 | |
 | | R7S910026CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 286 | |
 | | R7S910026CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 933 | |
 | | R7S910027CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 938 | |
 | | R7S910027CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 389 | |
 | | R7S910028CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 690 | |
 | | R7S910028CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 1,267 | |
 | | R7S910035CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 780 | |
| N/A | | R7S910035CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 244 | |
 | | R7S910036CBA#BC0 | Renesas | IC MCU 32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 458 | |
| N/A | | R7S910036CBG#AC0 | Renesas | IC MCU 32BIT ROMLESS 320FBGA | Microcontrollers | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 936 | |
 | | R7S921040VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 992 | |
 | | R7S921040VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 239 | |
 | | R7S921041VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 1,511 | |
 | | R7S921041VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 425 | |
 | | R7S921042VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 1,806 | |
 | | R7S921042VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 255 | |
 | | R7S921043VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 1,173 | |
 | | R7S921043VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 598 | |
 | | R7S921045VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 1,759 | |