 | | RNG90-MAVDA-T | Microchip Technology | FIPS RNG, 105C, I2C, 5K, UDFN | Microprocessors | 8-UDFN (2x3) | N/A | N/A | Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Supplier Device Package: 8-UDFN (2×3) | 152 | |
| N/A | | RNG90-SSVDA-T | Microchip Technology | FIPS RNG, 105C, I2C, SOIC | Microprocessors | N/A | N/A | N/A | N/A | 1,454 | |
| N/A | | RPIXP2400BAT | Intel | IC MPU INTEL 600MHZ 1356FCBGA | Microprocessors | 1356-FCBGA (37.5x37.5) | N/A | -40°C ~ 85°C | Core Processor: Intel® IXP2400 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR SDRAM, SRAM Display & Interface Controllers: LVDS Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5×37.5) Additional Interfaces: PCI, SPI, UART | 227 | |
| N/A | | RPIXP2800BA | Intel | IC MPU IXP2800 1GHZ 1356FCBGA | Microprocessors | 1356-FCBGA (37.5x37.5) | N/A | -40°C ~ 85°C | Core Processor: Intel® IXP2800 Number of Cores/Bus Width: 1 Core, 32-Bit Display & Interface Controllers: LVDS Operating Temperature: -40°C ~ 85°C Security Features: 3DES, AES, SHA-1 Mounting Type: Surface Mount Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5×37.5) Additional Interfaces: PCI, SPI, UART | 988 | |
| N/A | | RPIXP2800BB | Intel | IC MPU IXP2800 1.4GHZ 1356FCBGA | Microprocessors | 1356-FCBGA (37.5x37.5) | N/A | -40°C ~ 85°C | Core Processor: Intel® IXP2800 Number of Cores/Bus Width: 1 Core, 32-Bit Display & Interface Controllers: LVDS Operating Temperature: -40°C ~ 85°C Security Features: 3DES, AES, SHA-1 Mounting Type: Surface Mount Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5×37.5) Additional Interfaces: PCI, SPI, UART | 697 | |
| N/A | N/A | RT4G150-1CBG1657PROTO | Microchip Technology | RT4G150-1CBG1657PROTO | FPGAs | 1657-CBGA (42.5x42.5) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1657-BCBGA Supplier Device Package: 1657-CBGA (42.5×42.5) | 811 | |
| N/A | | RT4G150-1CGG1657B | Microchip Technology | RT4G150-1CGG1657B | FPGAs | 1657-CCGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 823 | |
| N/A | | RT4G150-1CGG1657E | Microchip Technology | RT4G150-1CGG1657E | FPGAs | 1657-CCGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 372 | |
| N/A | | RT4G150-1CGG1657M | Microchip Technology | RT4G150-1CGG1657M | FPGAs | 1657-CCGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 905 | |
| N/A | | RT4G150-1CGG1657PROTO | Microchip Technology | RT4G150-1CGG1657PROTO | FPGAs | 1657-CCGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 906 | |
| N/A | | RT4G150-1CGG1657R | Microchip Technology | RT4G150-1CGG1657R | FPGAs | 1657-CCGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 1,414 | |
| N/A | N/A | RT4G150-1CGG1657V | Microchip Technology | RT4G150-1CGG1657V | FPGAs | 1657-CCGA (42.5x42.5) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1657-BFCCGA Supplier Device Package: 1657-CCGA (42.5×42.5) | 204 | |
| N/A | N/A | RT4G150-1CQG352B | Microchip Technology | RT4G150-1CQG352B | FPGAs | 352-QFP (48x48) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-BFCQFP Exposed Pad and Tie Bar Supplier Device Package: 352-QFP (48×48) | 403 | |
| N/A | N/A | RT4G150-1CQG352E | Microchip Technology | RT4G150-1CQG352E | FPGAs | 352-QFP (48x48) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-BFCQFP Exposed Pad and Tie Bar Supplier Device Package: 352-QFP (48×48) | 1,006 | |
| N/A | N/A | RT4G150-1CQG352M | Microchip Technology | RT4G150-1CQG352M | FPGAs | 352-QFP (48x48) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-BFCQFP Exposed Pad and Tie Bar Supplier Device Package: 352-QFP (48×48) | 189 | |
| N/A | | RT4G150-1CQG352PROTO | Microchip Technology | RT4G150-1CQG352PROTO | FPGAs | 352-QFP (48x48) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 826 | |
| N/A | N/A | RT4G150-1CQG352R | Microchip Technology | RT4G150-1CQG352R | FPGAs | 352-QFP (48x48) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-BFCQFP Exposed Pad and Tie Bar Supplier Device Package: 352-QFP (48×48) | 830 | |
| N/A | N/A | RT4G150-1CQG352V | Microchip Technology | RT4G150-1CQG352V | FPGAs | 352-QFP (48x48) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-BFCQFP Exposed Pad and Tie Bar Supplier Device Package: 352-QFP (48×48) | 1,690 | |
| N/A | N/A | RT4G150-1LGG1657B | Microchip Technology | RT4G150-1LGG1657B | FPGAs | 1657-CLGA (42.5x42.5) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1657-BCLGA Supplier Device Package: 1657-CLGA (42.5×42.5) | 1,167 | |
| N/A | | RT4G150-1LGG1657E | Microchip Technology | RT4G150-1LGG1657E | FPGAs | 1657-CLGA (42.5x42.5) | 1.14 V - 1.26 V | -55°C – 125°C | Number of LABs/CLBs: 151824 Number of Logic Elements/Cells: 151824 | 483 | |