Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
RNG90-MAVDA-T
RNG90-MAVDA-TMicrochip TechnologyFIPS RNG, 105C, I2C, 5K, UDFNMicroprocessors8-UDFN (2x3)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
8-UFDFN Exposed Pad
Supplier Device Package:
8-UDFN (2×3)
152
N/A
RNG90-SSVDA-TMicrochip TechnologyFIPS RNG, 105C, I2C, SOICMicroprocessorsN/AN/AN/A

N/A

1,454
N/A
RPIXP2400BATIntelIC MPU INTEL 600MHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2400
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR SDRAM, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Additional Interfaces:
PCI, SPI, UART
227
N/A
RPIXP2800BAIntelIC MPU IXP2800 1GHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2800
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
3DES, AES, SHA-1
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Additional Interfaces:
PCI, SPI, UART
988
N/A
RPIXP2800BBIntelIC MPU IXP2800 1.4GHZ 1356FCBGAMicroprocessors1356-FCBGA (37.5x37.5)N/A-40°C ~ 85°C
Core Processor:
Intel® IXP2800
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
3DES, AES, SHA-1
Mounting Type:
Surface Mount
Package / Case:
1356-BBGA, FCBGA
Supplier Device Package:
1356-FCBGA (37.5×37.5)
Additional Interfaces:
PCI, SPI, UART
697
N/AN/ART4G150-1CBG1657PROTOMicrochip TechnologyRT4G150-1CBG1657PROTOFPGAs1657-CBGA (42.5x42.5)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Number of I/O:
720
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
1657-BCBGA
Supplier Device Package:
1657-CBGA (42.5×42.5)
811
N/ART4G150-1CGG1657BMicrochip TechnologyRT4G150-1CGG1657BFPGAs1657-CCGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
823
N/ART4G150-1CGG1657EMicrochip TechnologyRT4G150-1CGG1657EFPGAs1657-CCGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
372
N/ART4G150-1CGG1657MMicrochip TechnologyRT4G150-1CGG1657MFPGAs1657-CCGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
905
N/ART4G150-1CGG1657PROTOMicrochip TechnologyRT4G150-1CGG1657PROTOFPGAs1657-CCGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
906
N/ART4G150-1CGG1657RMicrochip TechnologyRT4G150-1CGG1657RFPGAs1657-CCGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
1,414
N/AN/ART4G150-1CGG1657VMicrochip TechnologyRT4G150-1CGG1657VFPGAs1657-CCGA (42.5x42.5)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
1657-BFCCGA
Supplier Device Package:
1657-CCGA (42.5×42.5)
204
N/AN/ART4G150-1CQG352BMicrochip TechnologyRT4G150-1CQG352BFPGAs352-QFP (48x48)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
352-BFCQFP Exposed Pad and Tie Bar
Supplier Device Package:
352-QFP (48×48)
403
N/AN/ART4G150-1CQG352EMicrochip TechnologyRT4G150-1CQG352EFPGAs352-QFP (48x48)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
352-BFCQFP Exposed Pad and Tie Bar
Supplier Device Package:
352-QFP (48×48)
1,006
N/AN/ART4G150-1CQG352MMicrochip TechnologyRT4G150-1CQG352MFPGAs352-QFP (48x48)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
352-BFCQFP Exposed Pad and Tie Bar
Supplier Device Package:
352-QFP (48×48)
189
N/ART4G150-1CQG352PROTOMicrochip TechnologyRT4G150-1CQG352PROTOFPGAs352-QFP (48x48)1.14 V - 1.26 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
166
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
826
N/AN/ART4G150-1CQG352RMicrochip TechnologyRT4G150-1CQG352RFPGAs352-QFP (48x48)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
352-BFCQFP Exposed Pad and Tie Bar
Supplier Device Package:
352-QFP (48×48)
830
N/AN/ART4G150-1CQG352VMicrochip TechnologyRT4G150-1CQG352VFPGAs352-QFP (48x48)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
352-BFCQFP Exposed Pad and Tie Bar
Supplier Device Package:
352-QFP (48×48)
1,690
N/AN/ART4G150-1LGG1657BMicrochip TechnologyRT4G150-1LGG1657BFPGAs1657-CLGA (42.5x42.5)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
1657-BCLGA
Supplier Device Package:
1657-CLGA (42.5×42.5)
1,167
N/ART4G150-1LGG1657EMicrochip TechnologyRT4G150-1LGG1657EFPGAs1657-CLGA (42.5x42.5)1.14 V - 1.26 V-55°C – 125°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
720
Number of LABs/CLBs:
151824
Number of Logic Elements/Cells:
151824
Qualification:
N/A
Total RAM Bits:
5325
483

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