 | | R7S921045VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 176LFBGA | Microprocessors | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 1,914 | |
 | | R7S921046VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 293 | |
 | | R7S921046VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 49 | |
 | | R7S921047VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 964 | |
 | | R7S921047VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 1,702 | |
 | | R7S921048VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 569 | |
 | | R7S921048VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 235 | |
 | | R7S921051VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 322 | |
 | | R7S921051VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 72 | |
 | | R7S921052VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 319 | |
 | | R7S921052VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 1,713 | |
 | | R7S921053VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 363 | |
 | | R7S921053VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 1,042 | |
 | | R7S921056VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 8 | |
 | | R7S921056VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (11×11) | 1,082 | |
 | | R7S921057VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 1,102 | |
 | | R7S921057VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 272-FBGA (17×17) | 436 | |
 | | R7S921058VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 447 | |
 | | R7S921058VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Supplier Device Package: 324-FBGA (19×19) | 1,094 | |
 | | R80188 | Advanced Micro Devices | IC MPU 8MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-CLCC (24.13×24.13) | 273 | |