Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R8A774A0HA01BG#U2N/AR8A774A0HA01BG#U2RenesasIC MPU RZ 1.2GHZ/1.5GHZ 1022BGAMicroprocessors1022-FPBGA (29x29)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
6 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB (2)
Voltage – I/O:
0.82V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1022-BGA
Supplier Device Package:
1022-FPBGA (29×29)
187
R8A774A1HA01BG#G2N/AR8A774A1HA01BG#G2RenesasIC MCU 32BIT ARM 1022FPBGAMicroprocessors1022-FPBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.5 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
6 Core, 64-Bit
RAM Controllers:
LPDDR4
Grade:
Industrial
Graphics Acceleration:
No
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
97
N/AR8A774A2HA01BG#G7RenesasSOC RZ/G2M HDMI OFF (FULL)Microprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
HMI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
504
N/AN/AR8A774A2HA01BG#GVRenesasSOC RZ/G2M HDMI OFF (FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HMI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
162
N/AR8A774A2HA01BG#U7RenesasSOC RZ/G2M HDMI OFF (BULK)Microprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
HMI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
522
N/AR8A774A2HA01BG#UVRenesasSOC RZ/G2M HDMI OFF (BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HMI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
899
N/AR8A774A3HA01BG#G7RenesasSOC RZ/G2M HDMI ON (FULL)Microprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
HMI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
115
N/AR8A774A3HA01BG#GVRenesasSOC RZ/G2M HDMI ON (FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HMI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
739
N/AR8A774A3HA01BG#U7RenesasSOC RZ/G2M HDMI ON (BULK)Microprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
HMI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
96
N/AR8A774A3HA01BG#UVRenesasSOC RZ/G2M HDMI ON (BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 2 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HMI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
1,750
R8A774B0HA01BG#G0N/AR8A774B0HA01BG#G0RenesasIC MPU RZ/G2N 1.5GHZ 1022FPBGAMicroprocessors1022-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB (2)
Voltage – I/O:
0.82V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1022-BGA
Supplier Device Package:
1022-FPBGA
651
N/AN/AR8A774B0HA01BG#G2RenesasSOC RZ/G2N HDMI OFF(FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
1,102
R8A774B0HA01BG#U0N/AR8A774B0HA01BG#U0RenesasIC MPU RZ/G2N 1.5GHZ 1022FPBGAMicroprocessors1022-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB (2)
Voltage – I/O:
0.82V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1022-BGA
Supplier Device Package:
1022-FPBGA
1,026
N/AR8A774B0HA01BG#U2RenesasSOC RZ/G2M HDMI OFFMicroprocessorsN/AN/A-40 °C – 85 °C
Speed:
1.5 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
813
R8A774B1HA01BG#G0N/AR8A774B1HA01BG#G0RenesasIC MCU 32BIT RZ/G2E HDMI OFFMicroprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.5 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
LVDS, MIPI-CSI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
1,578
N/AN/AR8A774B1HA01BG#G2RenesasSOC RZ/G2N HDMI ON(FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
80
N/AN/AR8A774B1HA01BG#U2RenesasSOC RZ/G2N HDMI ON(BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A57
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
1,010
R8A774C0HA01BG#G0R8A774C0HA01BG#G0RenesasIC MPU RZ/G2E 1.2GHZ 552FBGAMicroprocessors552-FBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-FBGA
Supplier Device Package:
552-FBGA (21×21)
1,232
R8A774C0HA01BG#GAR8A774C0HA01BG#GARenesasIC MPU RZ/G2E 1.2GHZ 552FPBGAMicroprocessors552-FPBGAN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-BGA
Supplier Device Package:
552-FPBGA
598
R8A774C0HA01BG#U0R8A774C0HA01BG#U0RenesasIC MPU RZ/G2E 1.2GHZ 552FBGAMicroprocessors552-FBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
552-FBGA
Supplier Device Package:
552-FBGA (21×21)
374

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