| N/A | N/A | S32G233ASBK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,098 | |
| N/A | N/A | S32G234MABK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,299 | |
| N/A | N/A | S32G234MABK0VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 527 | |
| N/A | N/A | S32G234MABK1VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,037 | |
| N/A | N/A | S32G234MABK1VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 256 | |
| N/A | N/A | S32G234MSBK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,397 | |
| N/A | N/A | S32G234MSBK0VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 551 | |
| N/A | N/A | S32G234MSBK1VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 252 | |
| N/A | N/A | S32G234MSBK1VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 529 | |
| N/A | N/A | S32G254AABK0CUCR | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,322 | |
| N/A | N/A | S32G254AABK0CUCT | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 61 | |
| N/A | N/A | S32G254AABK0VUCR | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 121 | |
| N/A | N/A | S32G254AABK0VUCT | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 598 | |
| N/A | N/A | S32G254AABK1VUCR | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,505 | |
| N/A | N/A | S32G254AABK1VUCT | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 819 | |
| N/A | N/A | S32G254ASBK0VUCR | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 747 | |
| N/A | N/A | S32G254ASBK0VUCT | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,239 | |
| N/A | N/A | S32G254ASBK1VUCR | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 234 | |
| N/A | N/A | S32G254ASBK1VUCT | NXP Semiconductors | S32G254A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 228 | |
| N/A | N/A | S32G274AABK0CUCR | NXP Semiconductors | S32G274A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 197 | |