 | | R8A774C0HA01BG#UA | Renesas | IC MPU RZ/G2E 1.2GHZ 552FPBGA | Microprocessors | 552-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 552-FPBGA | 411 | |
 | N/A | R8A774E0HA01BN#G0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1022-FPBGA | 128 | |
| N/A | | R8A774E0HA01BN#G6 | Renesas | SOC RZ/G2H HDMI OFF (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 589 | |
 | N/A | R8A774E0HA01BN#U0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 1022-FPBGA | 1,296 | |
| N/A | | R8A774E0HA01BN#U6 | Renesas | SOC RZ/G2H HDMI OFF (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,647 | |
| N/A | | R8A774E0HA01BN#YBC | Renesas | SOC RZ/G2H HDMI OFF (CS) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 499 | |
| N/A | | R8A774E0HA01BN#YJC | Renesas | SOC RZ/G2H HDMI OFF (WS) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Graphics Acceleration: Yes Display & Interface Controllers: DU USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 334 | |
 | N/A | R8A774E1HA01BN#G0 | Renesas | IC MCU 32BIT ARM 1022FPBGA | Microprocessors | 1022-FCBGA (29x29) | N/A | -40 °C – 85 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit USB: USB 2.0 OTG (2), USB 3.0 (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-R7 Display & Interface Controllers: LVDS, MIPI-CSI | 474 | |
| N/A | N/A | R8A774E1HA01BN#G6 | Renesas | SOC RZ/G2H HDMI ON (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 195 | |
 | N/A | R8A774E1HA01BN#U0 | Renesas | IC MCU 32BIT ARM 1022FPBGA | Microprocessors | 1022-FCBGA (29x29) | N/A | -40 °C – 85 °C | Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit USB: USB 2.0 OTG (2), USB 3.0 (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-R7 Display & Interface Controllers: LVDS, MIPI-CSI | 679 | |
| N/A | N/A | R8A774E1HA01BN#U6 | Renesas | SOC RZ/G2H HDMI ON (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-R7 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI USB: USB 2.0 OTG (2), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,211 | |
 | | R8A77800BDBGV | Renesas | IC MPU SUPERH 400MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -20 °C – 75 °C | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 1 Core, 32-Bit | 39 | |
 | | R8A77800BNBGV | Renesas | IC MPU SUPERH 400MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -20°C ~ 75°C (TA) | Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 449-FBGA (21×21) | 969 | |
| N/A | N/A | R8A77860HBGV | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) | 594 | |
| N/A | N/A | R8A77860HBGV#U0 | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) | 859 | |
| N/A | N/A | R8A77860NBGV | Renesas | IC MPU 533MHZ 593HFBGA | Microprocessors | 593-HFBGA (25x25) | N/A | -20°C ~ 85°C (TA) | Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, SDRAM Voltage – I/O: 1.25V, 1.5V, 3.3V Operating Temperature: -20°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 593-HFBGA (25×25) | 258 | |
 | N/A | R9A02G0214CBY#HC0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 719 | |
 | N/A | R9A02G0214CNE#BA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 190 | |
 | N/A | R9A02G0214CNE#UA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 511 | |
 | N/A | R9A02G0214CNH#BA0 | Renesas | 32-BIT MCU GP 48 MHZ RISC-V 128K | Microcontrollers | N/A | N/A | N/A | N/A | 599 | |