| N/A | N/A | RT4G150L-LGG1657V | Microchip Technology | RT4G150L-LGG1657V | FPGAs | 1657-CLGA (42.5x42.5) | 1.14V ~ 1.26V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 151824 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1657-BCLGA Supplier Device Package: 1657-CLGA (42.5×42.5) | 512 | |
 | | RU82566MM | Intel | IC TXRX FULL/HALF 1/1 81BGA | Drivers, Receivers, Transceivers | 81-BGA (10x10) | 0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V | 0°C ~ 70°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 160 mV Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 81-BGA (10×10) | 513 | |
| N/A | N/A | S05071D1PZPRG4 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,219 | |
| N/A | N/A | S0704038C0PLPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 594 | |
| N/A | N/A | S0907058A3PFPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,412 | |
| N/A | N/A | S106049AC3PZPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 176 | |
| N/A | N/A | S109014BC2PZPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 476 | |
| N/A | N/A | S1201024B0PLPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 519 | |
| N/A | N/A | S1404002A1NPMR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,388 | |
| N/A | N/A | S301030AB2PZPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 568 | |
| N/A | N/A | S301044APFPRG4 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 296 | |
| N/A | N/A | S32G233AABK0CUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,555 | |
| N/A | N/A | S32G233AABK0CUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 98 | |
| N/A | N/A | S32G233AABK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 563 | |
| N/A | N/A | S32G233AABK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,227 | |
| N/A | N/A | S32G233AABK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 11 | |
| N/A | N/A | S32G233AABK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 186 | |
| N/A | N/A | S32G233ASBK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 387 | |
| N/A | N/A | S32G233ASBK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 142 | |
| N/A | N/A | S32G233ASBK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 136 | |