Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/ART4G150L-LGG1657VMicrochip TechnologyRT4G150L-LGG1657VFPGAs1657-CLGA (42.5x42.5)1.14V ~ 1.26V-55°C ~ 125°C (TJ)
Number of Logic Elements/Cells:
151824
Total RAM Bits:
5325
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
1657-BCLGA
Supplier Device Package:
1657-CLGA (42.5×42.5)
512
RU82566MM
RU82566MMIntelIC TXRX FULL/HALF 1/1 81BGADrivers, Receivers, Transceivers81-BGA (10x10)0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V0°C ~ 70°C
Type:
Transceiver
Protocol:
IEEE 802.3
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Receiver Hysteresis:
160 mV
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
81-BGA
Supplier Device Package:
81-BGA (10×10)
513
N/AN/AS05071D1PZPRG4Texas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

1,219
N/AN/AS0704038C0PLPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

594
N/AN/AS0907058A3PFPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

1,412
N/AN/AS106049AC3PZPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

176
N/AN/AS109014BC2PZPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

476
N/AN/AS1201024B0PLPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

519
N/AN/AS1404002A1NPMRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

1,388
N/AN/AS301030AB2PZPRTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

568
N/AN/AS301044APFPRG4Texas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

296
N/AN/AS32G233AABK0CUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,555
N/AN/AS32G233AABK0CUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
98
N/AN/AS32G233AABK0VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
563
N/AN/AS32G233AABK0VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,227
N/AN/AS32G233AABK1VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
11
N/AN/AS32G233AABK1VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
186
N/AN/AS32G233ASBK0VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
387
N/AN/AS32G233ASBK0VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
142
N/AN/AS32G233ASBK1VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
136

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