 | | R9A06G033VGBA#AC1 | Renesas | IC MPU RZ 125/500MHZ 196LFBGA | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 226 | |
 | | R9A06G034VGBA#AC0 | Renesas | IC MPU RZ/N1L 125MHZ 196LFBGA | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 428 | |
 | | R9A06G034VGBA#AC1 | Renesas | IC MPU RZ/N1L 125MHZ 196LFBGA | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Voltage – I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 443 | |
 | | R9A06G043GBG#AC0 | Renesas | IC MPU 150MHZ 196LFBGA | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R4 Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 110 | |
 | | R9A06G061GNP#AA0 | Renesas | IC MCU | Microcontrollers | N/A | N/A | N/A | N/A | 770 | |
 | | R9A06G062GNP#AC1 | Renesas | SUB-GHZ/WI-SUN RADIO TRANSCEIVER | Microcontrollers | N/A | N/A | N/A | N/A | 260 | |
| N/A | | R9A06G064MGBG#BC0 | Renesas | SOC R-IN 32M4-CL3 CC-LINK IE TSN | Microcontrollers | 484-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 768KB (768K x 8) Voltage – Supply (Vcc/Vdd): 1.09V ~ 1.21V, 2.375V ~ 2.625V, 3.135V ~ 3.465V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 484-BGA (23×23) | 1,113 | |
| N/A | | R9A06G064SGBG#BC0 | Renesas | SOC R-IN CL3 CC-LINK IE TSN | Microcontrollers | 356-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 768KB (768K x 8) Voltage – Supply (Vcc/Vdd): 1.09V ~ 1.21V, 2.375V ~ 2.625V, 3.135V ~ 3.465V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 356-FBGA (17×17) | 486 | |
| N/A | | R9A07G017GBG#BC0 | Renesas | MICROPROCESSORS | Microcontrollers | N/A | N/A | N/A | N/A | 1,409 | |
 | | R9A07G043F00GBG#AC0 | Renesas | IC MPU RZ/G 1GHZ 266BGA | Microprocessors | 266-BGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 266-BGA (11×11) | 1,555 | |
 | | R9A07G043F00GBG#BC0 | Renesas | IC MPU RZ/G 1GHZ 266BGA | Microprocessors | 266-BGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 266-BGA (11×11) | 56 | |
 | | R9A07G043F01GBG#AC0 | Renesas | IC MPU RZ/G 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 282 | |
 | | R9A07G043F01GBG#BC0 | Renesas | IC MPU RZ/G 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 1,422 | |
| N/A | | R9A07G043F04GBG#AC0 | Renesas | IC MPU RZ/G 1GHZ 266LFBGA | Microprocessors | 266-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 266-LFBGA (11×11) | 878 | |
| N/A | | R9A07G043F04GBG#BC0 | Renesas | IC MPU RZ/G 1GHZ 266LFBGA | Microprocessors | 266-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 266-LFBGA (11×11) | 1,261 | |
| N/A | | R9A07G043F05GBG#AC0 | Renesas | IC MPU RZ/G 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 179 | |
| N/A | | R9A07G043F05GBG#BC0 | Renesas | IC MPU RZ/G 1GHZ 361LFBGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: AndesCore™ AX45MP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DDR3L, DDR4 Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 1,002 | |
 | | R9A07G043U11GBG#AC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Display & Interface Controllers: LCD Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 1,341 | |
| N/A | | R9A07G043U11GBG#BC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Display & Interface Controllers: LCD Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 29 | |
| N/A | | R9A07G043U12GBG#AC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Display & Interface Controllers: LCD Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-BGA (13×13) | 690 | |