| N/A | | R9A07G044L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 251 | |
| N/A | | R9A07G044L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 850 | |
 | | R9A07G044L23GBG#AC0 | Renesas | IC MPU 1.2GHZ 456BGA | Microprocessors | 456-BGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 456-BGA (15×15) | 639 | |
 | | R9A07G044L23GBG#BC0 | Renesas | SOC RZ/G2L 15MMBGA NON-SECUE DUA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 1,099 | |
| N/A | | R9A07G044L23GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 1,917 | |
 | | R9A07G044L24GBG#AC0 | Renesas | IC MPU 1.2GHZ 551BGA | Microprocessors | 551-BGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 551-BGA (21×21) | 409 | |
 | | R9A07G044L24GBG#BC0 | Renesas | SOC RZ/G2L 21MMBGA NON-SECUE DUA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,352 | |
| N/A | | R9A07G044L24GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,232 | |
| N/A | | R9A07G044L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 270 | |
| N/A | | R9A07G044L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 844 | |
| N/A | | R9A07G044L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 467 | |
| N/A | | R9A07G044L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 903 | |
| N/A | | R9A07G054L13GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 829 | |
| N/A | | R9A07G054L13GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 272 | |
| N/A | | R9A07G054L14GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,258 | |
| N/A | | R9A07G054L14GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 989 | |
| N/A | | R9A07G054L17GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 1,177 | |
| N/A | | R9A07G054L17GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 455 | |
| N/A | | R9A07G054L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,326 | |
| N/A | | R9A07G054L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 490 | |