R9A07G044L27GBG#BC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15) |
|---|---|
| Quantity | 397 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G044 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31 | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 456-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 456-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | ||
| Speed | 200MHz, 1.2GHz | Supplier Device Package | 456-LFBGA (15×15) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G044L27GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA
The R9A07G044L27GBG#BC0 is a Renesas RZ/G2L family microprocessor integrating ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a three-core, 64-bit configuration. It is designed for industrial embedded applications that require mixed 64-/32-bit processing, real-time control and connected edge functions.
Key value propositions include multi-core architecture with both application and real-time processors, integrated security engines, broad memory and display interface support, and industrial-grade operating range and qualification.
Key Features
- Core and Performance ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration; device listing includes 200 MHz and 1.2 GHz clock points as provided.
- Co-processor ARM® Mali-G31 shown as a co-processor in the device specification.
- Memory Support Integrated controllers supporting DDR3L and DDR4 memory technologies for flexible system memory design.
- Display Interfaces MIPI/CSI and MIPI/DSI display interface controller support for camera and panel connectivity.
- Networking & USB Dual Gigabit Ethernet (10/100/1000 Mbps, 2 ports) and two USB 2.0 ports for high-bandwidth connectivity and peripheral support.
- Additional Interfaces CANbus support for vehicle and industrial network connectivity.
- Security Hardware security features including AES, RSA, SHA-1, SHA-224, SHA-256 and a True Random Number Generator (TRNG) to support secure boot and cryptographic operations.
- Package & Mounting 456-LFBGA package (15 × 15 mm) tailored for surface-mount assembly and compact board layouts.
- Operating Range & Qualification Industrial qualification with an operating temperature range of −40 °C to 85 °C; RoHS compliant.
- Graphics Acceleration Graphics acceleration is specified as No in the product data.
Typical Applications
- Industrial Control Use the multi-core architecture and industrial qualification for realtime control, networked I/O and protocol handling in automation equipment.
- Human-Machine Interfaces (HMI) Combine the Cortex-A55 core(s) and MIPI display/camera interfaces to drive operator panels and visual input processing.
- Edge Networking & Gateways Dual Gigabit Ethernet and CANbus support enable network aggregation, protocol bridging and secure edge communications.
- Secure Embedded Systems On-chip cryptographic engines and TRNG provide hardware security primitives for secure boot, authenticated updates and data protection.
Unique Advantages
- Heterogeneous processing Combines Cortex-A55 and Cortex-M33 cores to separate application-level and real-time workloads without extra components.
- Broad memory compatibility DDR3L and DDR4 controller support simplifies migration across memory technologies and enables flexible BOM choices.
- Industrial-grade resilience Qualified for industrial use and specified for −40 °C to 85 °C operation to meet demanding field environments.
- On-chip security suite Hardware AES, RSA, SHA variants and TRNG help reduce system integration effort for secure designs.
- Compact package 456-LFBGA (15×15 mm) offers a small footprint for space-constrained embedded boards while supporting surface-mount manufacturing.
- Integrated connectivity Dual Gigabit Ethernet, USB 2.0 and CANbus reduce external interface components and streamline board-level design.
Why Choose R9A07G044L27GBG#BC0?
R9A07G044L27GBG#BC0 positions itself as a capable industrial microprocessor that combines application-class and real-time cores, comprehensive security features, and robust connectivity options. Its DDR3L/DDR4 memory support, MIPI display/camera interfaces, and dual Gigabit Ethernet make it suitable for edge devices that require mixed workloads, secure communications and HMI functionality.
The device’s industrial qualification, extended temperature range and compact 456-LFBGA package offer a balanced option for developers seeking a scalable, secure platform backed by the RZ family ecosystem and Renesas technical materials.
Request a quote or submit a procurement inquiry to evaluate R9A07G044L27GBG#BC0 for your next embedded design.
Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016
