R9A07G044L27GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15) |
|---|---|
| Quantity | 464 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G044 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31 | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 456-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 456-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | ||
| Speed | 200MHz, 1.2GHz | Supplier Device Package | 456-LFBGA (15×15) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G044L27GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA
The R9A07G044L27GBG#AC0 is a Renesas RZ/G2L family microprocessor IC integrating Arm® Cortex® processing cores for embedded HMI, IoT and edge applications. The device combines dual Arm® Cortex®-A55 application cores and an Arm® Cortex®-M33 real-time core in a 3-core, 64-bit configuration to support rich operating systems and real-time control on a single chip.
This MPU emphasizes integration and connectivity — with memory controllers for DDR3L/DDR4, dual Gigabit Ethernet interfaces, multiple USB and display/camera interfaces — and includes security primitives and industrial operating temperature support for robust embedded designs.
Key Features
- Core architecture Dual Arm® Cortex®-A55 application cores (up to 1.2GHz) paired with an Arm® Cortex®-M33 real-time core (200MHz) for mixed OS and real-time workloads.
- Memory 16-bit DDR3L/DDR4 memory controller support with inline ECC for improved reliability in embedded systems.
- Display & camera MIPI DSI display interface and MIPI CSI-2 camera interface options (4 lanes) or parallel interfaces for HMI and vision applications.
- Connectivity Dual 10/100/1000Mbps Ethernet MACs, multiple USB 2.0 ports, and CANbus support for diverse wired connectivity.
- Multimedia & graphics Integrated Arm® Mali™-G31 3D graphics and H.264 codec capabilities for user interfaces and video processing.
- Security Hardware crypto and entropy features including AES, RSA, SHA-1/SHA-224/SHA-256, and TRNG for secure boot and cryptographic functions.
- Peripherals Rich peripheral set including ADCs, multiple UART/SPI/I2C channels, PWM and timers to support sensor and actuator interfaces.
- System reliability & software Inline ECC for memory regions and long-term maintenance support on CIP Linux for sustained lifecycle support.
- Package & temperature 456-LFBGA (15 × 15 mm) surface-mount package rated for industrial operation from −40 °C to 85 °C; RoHS compliant.
- Power management Optimized PMIC support (reference PMIC noted in product literature) to simplify power-supply design for compact systems.
Typical Applications
- Home Appliances Enables responsive UIs, camera or sensor integration and network connectivity for smart appliance control.
- Industrial HMI Drives graphical displays, touch interfaces and Ethernet-connected control panels with real-time responsiveness.
- Smart Camera / Vision Camera interface and H.264 codec support for local image processing, streaming and edge analytics.
- Point of Sale / Intercom Provides multimedia, network and peripheral connectivity for compact POS terminals and intercom/doorbell systems.
- Building Control / Thermostat Integrates sensors, network connectivity and secure processing for building automation and HVAC control.
Unique Advantages
- High integration: Combines application and real-time cores, graphics, codecs and abundant I/O to reduce BOM and PCB area.
- Mixed workload capability: Cortex‑A55 cores for OS-level applications and a Cortex‑M33 core for deterministic control tasks.
- Industrial-grade reliability: Inline ECC memory support and −40 °C to 85 °C operating range for robust field operation.
- Comprehensive connectivity: Dual Gigabit Ethernet, USB, CAN and multiple serial interfaces simplify system-level integration.
- Hardware security primitives: AES/RSA/SHA and TRNG support protect device identity and enable secure boot and communications.
- Software longevity: Documented long-term maintenance support on CIP Linux for sustained product lifecycles.
Why Choose R9A07G044L27GBG#AC0?
This Renesas RZ/G2L MPU part is positioned for designs that require a balance of application-level performance, real-time control and broad connectivity in a single-chip solution. Its combination of dual Cortex‑A55 cores with a Cortex‑M33, memory ECC, dual Gigabit Ethernet and rich multimedia interfaces makes it suitable for industrial HMI, smart appliances, vision and other embedded edge use cases.
Engineers benefit from an integrated feature set that reduces external components, supports industrial temperature ranges, and includes hardware security building blocks and long-term software maintenance to simplify development and extend product longevity.
Request a quote or submit an inquiry to receive pricing and availability for R9A07G044L27GBG#AC0 and discuss how it fits your design requirements.
Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016
