R9A07G044L24GBG#BC0

The R9A07G044L24GBG#BC0 is a system-on-chip microprocessor from Renesas combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration. The device lists operating points including 200 MHz and 1.2 GHz and is supplied in a 551-LFBGA (21×21) package targeted at embedded and industrial applications.

Designed for embedded systems requiring integrated connectivity and on-chip security, this industrial-qualified SoC provides multiple high-speed interfaces, memory controller support for DDR3L and DDR4, and an extended operating temperature range for deployment in harsh environments.

Key Features

• Core Architecture  Dual ARM core types: ARM Cortex-A55 and ARM Cortex-M33 in a 3-core, 64-bit arrangement; documented operating points include 200 MHz and 1.2 GHz.
• Memory Support  Integrated memory controllers for DDR3L and DDR4, enabling use of common system memory configurations.
• Display and Camera Interfaces  MIPI-CSI and MIPI-DSI controllers provide direct connectivity for camera and display subsystems.
• Connectivity  Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and CANbus support for wired networking and fieldbus integration.
• Security Primitives  On-chip security features include AES, RSA, SHA-1, SHA-224, SHA-256 and a TRNG for cryptographic operations and entropy generation.
• Co-Processor  ARM Mali-G31 is listed as a co-processor/DSP; product data also indicates Graphics Acceleration: No.
• Package, Mounting and Qualification  Supplied in a 551-LFBGA (21×21) surface-mount package and specified for industrial qualification with an operating temperature range of −40 °C to 85 °C.
• Regulatory  RoHS compliant for environmental regulation adherence.

Typical Applications

• Industrial Control & Automation  Multi-core processing, dual gigabit Ethernet and CANbus support make the device suitable for networked industrial controllers and field devices operating across −40 °C to 85 °C.
• Edge Gateways & Network Appliances  Dual Ethernet ports and integrated security primitives support protocol handling, secure connectivity, and edge-level data processing.
• HMI and Vision Systems  MIPI-DSI and MIPI-CSI interfaces combined with DDR memory support enable camera input and display-driven human-machine interfaces.
• Secure Embedded Endpoints  Built-in AES/RSA/SHA cryptography and a TRNG facilitate device authentication and secure communications in embedded applications.

Unique Advantages

• Comprehensive Connectivity: Dual gigabit Ethernet, USB 2.0, MIPI-CSI/DSI and CANbus provide a broad set of interfaces for heterogeneous system integration.
• Mixed-Core Architecture: ARM Cortex-A55 and Cortex-M33 cores in a 3-core, 64-bit configuration allow partitioning of application and real-time tasks within a single SoC.
• Industrial-Grade Operating Range: Specified for −40 °C to 85 °C and industrial qualification to support deployment in demanding environments.
• On-Chip Security Building Blocks: AES, RSA, multiple SHA variants and a TRNG provide hardware primitives for secure boot, encryption and integrity checks.
• Flexible Memory Interface: DDR3L and DDR4 controller compatibility supports a range of memory choices for performance and cost optimization.
• Compact BGA Package: 551-LFBGA (21×21) surface-mount package suits space-constrained board designs.

Why Choose R9A07G044L24GBG#BC0?

The R9A07G044L24GBG#BC0 positions itself as a versatile embedded SoC that combines heterogeneous ARM processing cores, extensive wired and peripheral interfaces, and hardware security primitives in an industrial-qualified package. Its support for DDR3L/DDR4 memory and MIPI display/camera interfaces makes it appropriate for networked embedded systems, HMI, and edge applications.

For designs requiring industrial temperature operation, integrated connectivity and on-chip security features, this Renesas RZ/G2L-series device delivers an integrated platform that balances compute, interfaces and system-level capabilities for long-term embedded deployments.

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