R9A07G044L24GBG#YJ0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 3 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 50 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L24GBG#YJ0 – IC MPU RZ 200MHz/1.2GHz 551-LFBGA

The R9A07G044L24GBG#YJ0 is a Renesas RZ/G2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration. It provides mixed‑function processing with connectivity and security capabilities targeted at embedded and industrial applications.

With nominal operating points of 200 MHz and 1.2 GHz and support for common memory and display interfaces, this device is positioned for designs that require multi-core processing, wired networking, and industrial temperature range operation.

Key Features

  • Core Architecture: ARM® Cortex®-A55 and ARM® Cortex®-M33 cores arranged as a 3-core, 64-bit MPU for heterogeneous embedded processing.
  • Performance Points: Listed frequency points include 200 MHz and 1.2 GHz to support control and higher‑performance tasks within the same device.
  • Co-processor / DSP: ARM® Mali‑G31 is listed as a co-processor, enabling offload for applicable processing tasks.
  • Memory Support: Integrated controllers for DDR3L and DDR4 memory types for flexible system memory options.
  • Display & Camera Interfaces: MIPI CSI and MIPI DSI display interface controllers provide connectivity for camera and display subsystems.
  • Wired Networking: Dual Gigabit Ethernet ports (10/100/1000 Mbps ×2) for robust wired connectivity.
  • USB Connectivity: Two USB 2.0 ports for peripheral and host connectivity.
  • Additional Interfaces: CANbus support for vehicle-grade or industrial field network connectivity.
  • Security Features: Hardware support for AES, RSA, SHA‑1, SHA‑224, SHA‑256 and TRNG for cryptographic and random number requirements.
  • Package & Mounting: 551‑LFBGA (21×21) package with surface-mount mounting for compact board integration.
  • Qualification & Temperature Range: Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in industrial environments.
  • RoHS Compliance: RoHS status marked as compliant.
  • Graphics Acceleration: Graphics acceleration is listed as No.

Typical Applications

  • Industrial Control: Multi-core processing, industrial qualification, and CANbus support make the device suitable for embedded control and automation equipment.
  • Networking & Gateways: Dual 10/100/1000 Mbps Ethernet ports and USB interfaces enable use in wired network appliances and industrial gateway designs.
  • Vision & Display Systems: MIPI CSI and MIPI DSI interfaces support camera and display integration for machine vision or HMI modules.
  • Secure Embedded Systems: On‑chip AES/RSA/SHA and TRNG capabilities support secure communications and authenticated device operation.

Unique Advantages

  • Heterogeneous Multi‑Core Architecture: Combines ARM® Cortex® application and microcontroller cores in a single device to consolidate control and application processing.
  • Dual Gigabit Ethernet: Two independent 10/100/1000 Mbps ports provide bandwidth and redundancy options for networking use cases.
  • Flexible Memory Interfaces: Support for DDR3L and DDR4 memory types allows selection based on cost, performance, and availability.
  • Industrial Temperature Rating: −40 °C to 85 °C operation qualifies the part for harsh-environment embedded deployments.
  • Hardware Security Primitives: Built-in AES, RSA, SHA family support and TRNG reduce external security component requirements.
  • Compact BGA Package: 551‑LFBGA (21×21) provides a high-pin-count footprint for dense system integration in a small board area.

Why Choose R9A07G044L24GBG#YJ0?

The R9A07G044L24GBG#YJ0 delivers a balanced combination of multi-core processing, wired networking, and hardware security features in an industrially qualified package. Its support for common memory types, MIPI display/camera interfaces, and multiple connectivity options makes it suitable for embedded designers seeking a consolidated MPU for industrial and networking applications.

This part is appropriate for teams building robust, scalable products that require long-term availability, secure processing, and industrial temperature operation, while benefiting from Renesas’ RZ/G2L series integration and ecosystem.

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