R9A07G044L23GBG#BC0

The R9A07G044L23GBG#BC0 is a Renesas SoC from the R9A07G044 series featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration. The device exposes documented operating points including 200 MHz and 1.2 GHz and integrates a range of I/O, memory controllers and security engines targeted at industrial embedded designs.

Its combination of multicore processing, hardware security primitives and multiple high-speed interfaces makes it suitable for networked, industrial and embedded applications that require integration and industrial qualification.

Key Features

• Core and Performance  ARM® Cortex®-A55 and ARM® Cortex®-M33 processors in a 3-core, 64-bit configuration; documented speeds include 200 MHz and 1.2 GHz.
• Memory  Integrated controllers for DDR3L and DDR4 memory to support system memory requirements.
• Interfaces  Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, MIPI-CSI and MIPI-DSI display interfaces, and CANbus connectivity.
• Security  On-chip cryptographic engines including AES, RSA, SHA-1, SHA-224 and SHA-256 plus a true random number generator (TRNG).
• Graphics  No graphics acceleration; suitable for designs that do not require hardware graphics offload.
• Package and Mounting  456-LFBGA package in a 15 × 15 mm footprint, surface-mount mounting type for compact PCB integration.
• Qualification and Temperature  Industrial qualification with an operating temperature range of −40 °C to 85 °C.
• Regulatory  RoHS compliant.

Unique Advantages

• Multicore flexibility: The mix of Cortex-A55 and Cortex-M33 cores in a 3-core, 64-bit configuration provides options for separating application and real-time tasks.
• Integrated networking: Dual gigabit Ethernet interfaces allow robust wired networking without adding external PHY-centric complexity.
• Memory support flexibility: Native DDR3L and DDR4 controller support lets designers choose between memory technologies based on cost and performance.
• Hardware security primitives: Built-in AES, RSA, SHA variants and TRNG provide on-chip cryptographic capabilities for data protection and secure boot flows.
• Industrial readiness: Industrial qualification and −40 °C to 85 °C operation suit deployments in extended-temperature environments.
• Compact BGA footprint: 456-LFBGA (15 × 15 mm) package enables dense integration for space-constrained designs.

Why Choose R9A07G044L23GBG#BC0?

R9A07G044L23GBG#BC0 positions itself as a compact, industrial-grade SoC option that combines multicore processing, a broad set of wired and sensor interfaces, and on-chip security engines. Its memory controller options and dual gigabit Ethernet capability make it suitable for embedded systems that require integration of connectivity, processing and security in a small footprint.

Designed by Renesas and offered in a 456-LFBGA package with surface-mount mounting, this device is aimed at engineering teams specifying an industrially qualified SoC with clearly listed interface and security features for long-term embedded projects.

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