R9A07G044L18GBG#BC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21) |
|---|---|
| Quantity | 1,677 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G044 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31 | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 551-LFBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 551-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | ||
| Speed | 200MHz, 1.2GHz | Supplier Device Package | 551-LFBGA (21×21) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G044L18GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA
The R9A07G044L18GBG#BC0 is a Renesas RZ/G2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a two‑core, 64‑bit configuration. Product data lists operating points at 200 MHz and 1.2 GHz and a 551‑LFBGA (21×21) package, making it suitable for embedded and industrial applications that require integrated interfaces, networking, and hardware security.
Key Features
- Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2‑core, 64‑bit configuration as specified for the RZ/G2L family.
- Clocking Product information lists core operating points at 200 MHz and 1.2 GHz; the specification field includes 200 MHz.
- Graphics/Co-processor Includes ARM® Mali‑G31 as a co-processor/DSP as indicated in the product data.
- Memory Support Integrated controllers for DDR3L and DDR4 memory to support system memory requirements.
- Display and Imaging Interfaces MIPI CSI and MIPI DSI display/interface controllers are listed for camera and display connectivity.
- Connectivity Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and CANbus support provide broad wired networking and peripheral options.
- Security Hardware security features include AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG as specified in the product data.
- Industrial Qualification & Operating Range Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.
- Package & Mounting Supplied in a 551‑LFBGA (21×21) surface‑mount package for compact board integration.
- Regulatory Status RoHS compliant as stated in the environmental data.
Typical Applications
- Industrial Embedded Systems Use in industrial controllers and automation equipment where industrial qualification and Ethernet/CANbus connectivity are required.
- Networked Devices Networked gateways and communication modules that leverage the dual Gigabit Ethernet and USB 2.0 interfaces.
- Imaging and Display Subsystems Camera and display applications making use of MIPI CSI and MIPI DSI interfaces and Mali‑G31 processing capability.
- Secure Edge Controllers Embedded controllers that require on‑chip cryptographic primitives (AES/RSA/SHA/TRNG) for secure operation.
Unique Advantages
- Dual ARM Core Design: Combines ARM® Cortex®-A55 and Cortex®-M33 cores in a 64‑bit, 2‑core configuration to partition application and real‑time tasks.
- Broad I/O and Networking: Dual Gigabit Ethernet, USB 2.0 ports, and CANbus provide flexible wired connectivity for industrial and networked designs.
- Memory Flexibility: Support for DDR3L and DDR4 memory controllers simplifies integration with a range of system memory choices.
- On‑Chip Security: AES, RSA, multiple SHA variants and a TRNG are provided for hardware‑based cryptography and secure key generation.
- Industrial Temperature Range: Rated for −40 °C to 85 °C to meet environmental requirements in industrial deployments.
- Compact Surface‑Mount Package: 551‑LFBGA (21×21) package supports high‑density PCB designs.
Why Choose R9A07G044L18GBG#BC0?
This Renesas RZ/G2L microprocessor IC delivers a compact, industrially qualified platform combining dual ARM cores, dedicated security primitives, and a comprehensive set of connectivity and display interfaces. It is positioned for embedded and industrial designs that require a balance of compute, secure operation, and networked I/O in a space‑efficient LFBGA package.
R9A07G044L18GBG#BC0 is suited to developers and system designers building networked controllers, imaging/display subsystems, and secure edge devices where integration, temperature range, and interface density are key selection criteria.
Request a quote or submit an inquiry for pricing and availability of R9A07G044L18GBG#BC0 to move your design forward.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016