R9A07G044L18GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 1,677 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1.2GHzSupplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L18GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G044L18GBG#BC0 is a Renesas RZ/G2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a two‑core, 64‑bit configuration. Product data lists operating points at 200 MHz and 1.2 GHz and a 551‑LFBGA (21×21) package, making it suitable for embedded and industrial applications that require integrated interfaces, networking, and hardware security.

Key Features

  • Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2‑core, 64‑bit configuration as specified for the RZ/G2L family.
  • Clocking Product information lists core operating points at 200 MHz and 1.2 GHz; the specification field includes 200 MHz.
  • Graphics/Co-processor Includes ARM® Mali‑G31 as a co-processor/DSP as indicated in the product data.
  • Memory Support Integrated controllers for DDR3L and DDR4 memory to support system memory requirements.
  • Display and Imaging Interfaces MIPI CSI and MIPI DSI display/interface controllers are listed for camera and display connectivity.
  • Connectivity Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and CANbus support provide broad wired networking and peripheral options.
  • Security Hardware security features include AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG as specified in the product data.
  • Industrial Qualification & Operating Range Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.
  • Package & Mounting Supplied in a 551‑LFBGA (21×21) surface‑mount package for compact board integration.
  • Regulatory Status RoHS compliant as stated in the environmental data.

Typical Applications

  • Industrial Embedded Systems Use in industrial controllers and automation equipment where industrial qualification and Ethernet/CANbus connectivity are required.
  • Networked Devices Networked gateways and communication modules that leverage the dual Gigabit Ethernet and USB 2.0 interfaces.
  • Imaging and Display Subsystems Camera and display applications making use of MIPI CSI and MIPI DSI interfaces and Mali‑G31 processing capability.
  • Secure Edge Controllers Embedded controllers that require on‑chip cryptographic primitives (AES/RSA/SHA/TRNG) for secure operation.

Unique Advantages

  • Dual ARM Core Design: Combines ARM® Cortex®-A55 and Cortex®-M33 cores in a 64‑bit, 2‑core configuration to partition application and real‑time tasks.
  • Broad I/O and Networking: Dual Gigabit Ethernet, USB 2.0 ports, and CANbus provide flexible wired connectivity for industrial and networked designs.
  • Memory Flexibility: Support for DDR3L and DDR4 memory controllers simplifies integration with a range of system memory choices.
  • On‑Chip Security: AES, RSA, multiple SHA variants and a TRNG are provided for hardware‑based cryptography and secure key generation.
  • Industrial Temperature Range: Rated for −40 °C to 85 °C to meet environmental requirements in industrial deployments.
  • Compact Surface‑Mount Package: 551‑LFBGA (21×21) package supports high‑density PCB designs.

Why Choose R9A07G044L18GBG#BC0?

This Renesas RZ/G2L microprocessor IC delivers a compact, industrially qualified platform combining dual ARM cores, dedicated security primitives, and a comprehensive set of connectivity and display interfaces. It is positioned for embedded and industrial designs that require a balance of compute, secure operation, and networked I/O in a space‑efficient LFBGA package.

R9A07G044L18GBG#BC0 is suited to developers and system designers building networked controllers, imaging/display subsystems, and secure edge devices where integration, temperature range, and interface density are key selection criteria.

Request a quote or submit an inquiry for pricing and availability of R9A07G044L18GBG#BC0 to move your design forward.

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