R9A07G044L17GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 1,171 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1.2GHzSupplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L17GBG#AC0 – IC MPU RZ 200MHz/1.2GHz 456-LFBGA

The R9A07G044L17GBG#AC0 is a Renesas RZ/G2L family microprocessor combining 64-bit application processing and real-time control in a single device. It integrates dual Arm® Cortex®-A55 cores (1.2GHz) alongside an Arm® Cortex®-M33 (200MHz) for mixed application and control workloads, and targets HMI, IoT edge and industrial applications that require a balance of CPU performance, multimedia and peripheral integration.

Key Features

  • Core architecture Dual Arm® Cortex®-A55 cores at 1.2GHz plus an Arm® Cortex®-M33 at 200MHz provide a split between high-level OS/application processing and real-time control.
  • Graphics and video Integrated Arm® Mali‑G31 GPU and H.264 encoder/decoder for 1080p video support enable multimedia and camera/ display use cases.
  • Memory support 16-bit DDR3L/DDR4 memory controller with inline ECC and on-chip shared memory (L3 256KB ECC) for system memory flexibility and improved reliability.
  • Display and camera interfaces MIPI DSI (4 lanes) display and MIPI CSI-2 (4 lanes) camera interfaces plus parallel options support modern HMI and imaging designs.
  • Connectivity Dual Gigabit Ethernet MACs (10/100/1000 Mbps), dual USB 2.0 ports and CANbus interface provide multiple wired connectivity options for industrial and IoT systems.
  • Security On-chip security features include AES, RSA, SHA-1, SHA-224, SHA-256, TRNG and secure-boot capable primitives for device and data protection.
  • System peripherals Rich peripheral set indicated in the series includes ADC, PWM, multiple UART/I2C/SPI, SDHI and timers for broad I/O and control integration.
  • Package and reliability 456-ball LFBGA package (15×15 mm) with industrial operating temperature range of −40°C to 85°C and RoHS compliance for industrial deployments.

Typical Applications

  • Home Appliances — Use the MPU for appliance HMI, sensor integration and connected-device control with multimedia support.
  • Industrial HMI — Drive displays and touch interfaces while handling networking and secure communications in industrial control panels.
  • Smart Camera / Visual Edge — Combine MIPI camera input, Mali‑G31 GPU and H.264 codec for imaging, encoding and edge processing tasks.
  • Point of Sales / Intercoms — Provide secure connectivity, multimedia and application processing for compact transaction and communication devices.
  • Smart Thermostats / IoT Edge Devices — Integrate networked control, sensor I/O and secure communications in compact, single‑chip designs.

Unique Advantages

  • Balanced dual-core architecture: Combines Cortex‑A55 application cores and a Cortex‑M33 real‑time core to separate OS-level tasks from deterministic control functions.
  • Integrated multimedia pipeline: Mali‑G31 GPU plus H.264 encoder/decoder and MIPI interfaces reduce external component needs for camera and display systems.
  • Memory flexibility with reliability: DDR3L/DDR4 controller with inline ECC and on-chip shared L3 (256KB ECC) supports robust system memory configurations.
  • Industrial-grade connectivity: Dual Gigabit Ethernet, USB 2.0 and CANbus support common industrial networking and peripheral requirements.
  • Comprehensive security features: Hardware crypto primitives and TRNG enable secure boot and cryptographic operations to protect device and data integrity.
  • Industrial temperature rating and packaging: 456‑LFBGA package and −40°C to 85°C operating range suit deployment in industrial environments.

Why Choose R9A07G044L17GBG#AC0?

The R9A07G044L17GBG#AC0 positions itself as an integrated MPU solution for designs that require application-level performance, real-time control and multimedia capabilities in a single device. Its combination of dual Cortex‑A55 cores, a Cortex‑M33 core, Mali‑G31 graphics and H.264 support, along with DDR3L/DDR4 memory support with ECC, makes it suitable for HMI, smart camera and industrial edge applications that demand connectivity, security and reliability.

Engineers designing compact, networked embedded systems can leverage the device’s broad peripheral set and industrial temperature rating to simplify system architecture and achieve long-term maintainability in production environments.

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