R9A07G044L17GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 351 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1.2GHzSupplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L17GBG#BC0 – ARM® Cortex®-A55 & Cortex®-M33 2‑Core MPU, 456‑LFBGA

The R9A07G044L17GBG#BC0 is a Renesas RZ/G2L microprocessor integrating ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2‑core, 64‑bit configuration. It combines high-performance application processing and real-time control capabilities for industrial edge devices and embedded systems.

Designed for edge computing and HMI-enabled products, this industrial‑qualified MPU targets applications that require heterogeneous processing, robust security primitives, and a broad set of peripheral interfaces while operating across an extended temperature range.

Key Features

  • CPU Cores — Dual-core 64‑bit architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 processors for application-level and real-time tasks.
  • Performance — Core frequencies listed at 200 MHz and 1.2 GHz to support mixed workload partitioning between control and application domains.
  • Graphics & DSP — Includes ARM® Mali‑G31 listed as a co-processor/DSP; graphics acceleration is indicated as unavailable in the provided data.
  • Memory Support — Integrated controllers for DDR3L and DDR4 memory to accommodate a range of system memory configurations.
  • Display Interfaces — MIPI CSI and MIPI DSI display/interface controllers for camera and display connectivity.
  • Networking & Connectivity — Dual Gigabit Ethernet (10/100/1000 Mbps) ports, two USB 2.0 ports, and CANbus for real-time field communications.
  • Security — Hardware security primitives including AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a true random number generator (TRNG) for secure boot and data protection.
  • Package & Mounting — 456‑LFBGA surface‑mount package (15 × 15 mm) suitable for compact board designs.
  • Industrial Qualification & Temperature — Specified for industrial use with an operating temperature range of -40 °C to 85 °C.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Industrial Automation — Real-time control, networking and HMI functions for factory equipment and process control systems.
  • Robotics & Motion Control — Heterogeneous cores support deterministic control on the M33 and higher-level planning or vision tasks on the A55.
  • Building Management & Infrastructure — Edge processing for building automation, monitoring and secure connectivity across field networks.
  • Smart Appliances & Embedded HMI — Drive user interfaces and sensor/camera interfaces while handling secure communications and local processing.

Unique Advantages

  • Heterogeneous processing — Combines application-grade and real-time cores to partition workloads and improve system determinism.
  • Broad interface set — On-chip Ethernet, USB, MIPI, and CANbus reduce external interface components and simplify system design.
  • Industrial readiness — Industrial qualification and extended operating temperature range support deployment in harsh environments.
  • Integrated security — Multiple cryptographic engines and TRNG enable robust device and data protection without additional security ICs.
  • Memory flexibility — Support for DDR3L and DDR4 memory controllers allows designers to scale memory bandwidth and capacity to application needs.
  • Compact packaging — 456‑LFBGA (15×15 mm) package enables high-density board layouts for space-constrained designs.

Why Choose R9A07G044L17GBG#BC0?

This Renesas RZ/G2L device positions itself as a versatile MPU for edge and embedded systems that need a mix of application performance and real-time control. Its dual-core, 64‑bit architecture, industrial qualification, and integrated security features make it suitable for engineers building robust, connected devices that require both local processing and deterministic control.

As part of the RZ family, it benefits from a documented development environment and ecosystem resources for Linux and RTOS deployment, helping accelerate time‑to‑market and long‑term maintainability.

Request a quote or submit an inquiry referencing part number R9A07G044L17GBG#BC0 to discuss availability, lead times, and volume pricing.

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