R9A07G044L18GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 307 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1.2GHzSupplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L18GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G044L18GBG#AC0 is a Renesas RZ/G2L microprocessor IC featuring a heterogeneous dual-core architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. The device combines 64‑bit processing capability (A55) with an M33 companion core, supporting operating points listed at 200 MHz and 1.2 GHz.

Designed for embedded and industrial applications, the device integrates memory controllers, multiple high-speed interfaces and hardware security primitives to enable connected, secure systems within a compact 551‑LFBGA (21×21) package and an industrial operating temperature range.

Key Features

  • Core Architecture Dual-core configuration with ARM® Cortex®-A55 and ARM® Cortex®-M33 processors providing 64‑bit processing and real-time control capability within one device.
  • Performance Points Processor speed points indicated at 200 MHz and 1.2 GHz to support a range of compute and control tasks.
  • Graphics/Co-processor Includes ARM® Mali‑G31 as a co-processor for graphics and related processing acceleration.
  • Memory Support Integrated DDR3L and DDR4 memory controller support for flexible system memory configurations.
  • Display and Camera Interfaces MIPI CSI and MIPI DSI interfaces enable camera input and display output connectivity for visual applications.
  • Connectivity Two 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and CANbus provide broad wired communication options for networking and control.
  • Security Features Hardware security primitives including AES, RSA, SHA-1, SHA-224, SHA-256 and TRNG support secure boot, encryption and integrity functions.
  • Industrial Qualification Specified with industrial qualification and an operating temperature range of −40 °C to 85 °C for robust field deployment.
  • Package and Mounting 551‑LFBGA (21×21) surface-mount package suitable for compact embedded system designs.

Typical Applications

  • Industrial Control and Gateways Dual Gigabit Ethernet ports and CANbus support networked industrial controllers, protocol gateways and edge devices requiring robust connectivity.
  • Vision and Display Systems MIPI CSI and DSI interfaces combined with the Mali‑G31 co-processor enable camera capture and display pipelines for HMI and machine vision tasks.
  • Secure Embedded Systems Integrated AES, RSA, SHA family algorithms and TRNG enable secure communications and data protection in embedded applications.
  • Embedded Networking Devices 64‑bit processing alongside multiple Ethernet and USB interfaces supports networked appliances, media gateways and protocol converters.

Unique Advantages

  • Heterogeneous Dual-Core Design: Combines Cortex‑A55 and Cortex‑M33 cores to partition application-level processing and real-time control on one die.
  • Broad I/O Integration: Multiple Ethernet ports, USB, CANbus, and MIPI interfaces reduce external component count and simplify board-level design.
  • Flexible Memory Support: DDR3L and DDR4 controller compatibility allows designers to select memory technology that matches performance and cost targets.
  • Built-In Security Primitives: On-chip AES, RSA, SHA and TRNG accelerate cryptographic tasks and support secure system architectures.
  • Industrial Temperature Rating: −40 °C to 85 °C qualification supports deployment in demanding environments.
  • Compact LFBGA Packaging: 551‑LFBGA (21×21) package enables high-density designs while maintaining surface-mount manufacturability.

Why Choose R9A07G044L18GBG#AC0?

The R9A07G044L18GBG#AC0 positions itself as a versatile embedded processor for industrial and connected-system designs that require a mix of application processing, real‑time control and secure communications. Its combination of ARM® Cortex® A‑class and M‑class cores, integrated memory controllers, comprehensive wired interfaces and hardware security primitives delivers a well-rounded platform for systems needing both compute and connectivity.

This part is suited to engineers building compact, industrial-grade systems where integration, interface variety and temperature resilience matter. Leveraging Renesas’ RZ/G2L family characteristics, the device provides a clear configuration path for projects focused on networked control, vision/display integration and secure edge processing.

Request a quote or submit an inquiry to receive pricing and availability information for R9A07G044L18GBG#AC0 and to discuss how it can fit your embedded or industrial design requirements.

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