R9A07G044L23GBG#YJ0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 615 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L23GBG#YJ0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA

The R9A07G044L23GBG#YJ0 is a Renesas RZ/G2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration. The device documents both 200 MHz and 1.2 GHz operating points and is provided in a 456-LFBGA (15×15) surface-mount package.

Designed for embedded and industrial applications, this MPU combines heterogeneous cores, dual gigabit Ethernet, MIPI display/camera interfaces, and hardware security primitives to address edge device workloads such as HMI, networking, and real-time control.

Key Features

  • Core & Architecture 3 cores, 64-bit architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 processors; documented frequency points include 200 MHz and 1.2 GHz.
  • Security Built-in security features include AES, RSA, SHA-1, SHA-224, SHA-256 and a TRNG for cryptographic operations and secure key generation.
  • Co-processor / DSP Includes an ARM® Mali-G31 co-processor (listed as a DSP/co-processor in the specifications).
  • Memory & Display Memory controller support for DDR3L and DDR4; display and camera interfaces include MIPI/CSI and MIPI/DSI.
  • Connectivity & I/O Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and additional interfaces including CANbus for mixed connectivity needs.
  • Package & Mounting 456-LFBGA package (15×15 mm) specified for surface-mount applications.
  • Industrial Qualification & Temperature Range Rated for Industrial qualification with an operating temperature range of -40 °C to 85 °C.
  • Environmental Compliance RoHS compliant.
  • Graphics Acceleration (listed) Graphics acceleration status listed as: No.

Typical Applications

  • Industrial Control & Automation — Dual gigabit Ethernet and industrial-grade temperature range make the MPU suitable for networked control and factory-edge processing.
  • Human-Machine Interfaces (HMI) — MIPI display and camera interfaces combined with heterogeneous cores support responsive operator interfaces and local image pipelines.
  • Edge Networking & Gateways — Two 10/100/1000 Mbps Ethernet ports and multiple USB and CANbus interfaces enable high-throughput edge gateways and protocol bridging.
  • Secure Edge Devices — On-chip AES/RSA/SHA/TRNG security primitives facilitate device authentication, secure communications, and cryptographic workloads at the edge.

Unique Advantages

  • Heterogeneous Core Mix: Combines ARM® Cortex®-A55 and Cortex®-M33 cores for flexible partitioning of high-level application processing and real-time tasks.
  • Integrated Networking: Dual gigabit Ethernet ports provide hardware-level bandwidth for industrial networking and data aggregation without external switches.
  • Security Built In: Comprehensive cryptographic support and a TRNG enable secure boot, secure communications, and on-device key handling.
  • Flexible Memory Options: Support for DDR3L and DDR4 memory controllers allows designers to select memory configurations that balance cost and performance.
  • Industrial Ready: Specified industrial qualification and a -40 °C to 85 °C operating range support deployment in harsh and wide-temperature environments.
  • Compact Surface-Mount Package: 456-LFBGA (15×15) provides a dense, manufacturable footprint for space-constrained embedded systems.

Why Choose R9A07G044L23GBG#YJ0?

As part of the Renesas RZ family, the R9A07G044L23GBG#YJ0 integrates a multi-core 64-bit architecture, robust networking, and on-chip security features in an industrial-temperature, surface-mount package. It is positioned for embedded designs that require a mix of application processing, secure edge functionality, and reliable connectivity.

This MPU is well suited to engineers building industrial HMI, edge gateways, and secure embedded systems who need a compact, RoHS-compliant solution with flexible memory support and dual gigabit Ethernet connectivity.

If you require pricing, availability, or a technical quotation for R9A07G044L23GBG#YJ0, submit a request for a quote or an inquiry to receive current lead-time and ordering information.

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