R9A07G044L13GBG#BC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15) |
|---|---|
| Quantity | 166 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G044 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31 | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 456-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 456-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz, 1.2GHz | ||
| Supplier Device Package | 456-LFBGA (15×15) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G044L13GBG#BC0 – ARM® Cortex®-A55 / Cortex®-M33 2‑Core 64‑Bit MPU (200 MHz / 1.2 GHz), 456‑LFBGA
The R9A07G044L13GBG#BC0 is a dual‑core microprocessor from Renesas' RZ/G2L family featuring ARM® Cortex®‑A55 and ARM® Cortex®‑M33 cores. It targets embedded and edge applications that require combined application processing and real‑time control, offering a heterogeneous 64‑bit/32‑bit architecture with listed clock rates of 1.2 GHz and 200 MHz.
Designed for industrial environments, the device integrates a range of system interfaces and security functions to support networked edge devices, human‑machine interfaces, and industrial control systems while operating across an extended temperature range.
Key Features
- Cores and Architecture ARM® Cortex®‑A55 and ARM® Cortex®‑M33 dual‑core configuration; the part is described with clock rates of 1.2 GHz and 200 MHz and a 64‑bit core capability.
- Co‑processor Includes ARM® Mali‑G31 listed as a co‑processor.
- Memory Controllers Integrated controllers for DDR3L and DDR4 memory types to support system memory requirements.
- Display Interfaces MIPI interfaces including CSI and DSI are provided for camera and display connectivity.
- Networking and USB Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports for wired networking and peripheral connectivity.
- Vehicle/Field Bus CANbus interface included for control and field communications.
- Security Hardware security primitives including AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG for secure key generation and cryptographic operations.
- Package and Mounting 456‑LFBGA (15×15) surface‑mount package for compact board integration.
- Operating Range Industrial temperature qualification with an operating temperature range of −40 °C to 85 °C.
- Compliance RoHS‑compliant product.
- Graphics Acceleration Graphics acceleration field is listed as "No" in the provided specifications.
Typical Applications
- Industrial Automation Edge controllers and machine interfaces that require industrial‑grade temperature operation, Ethernet connectivity, and field bus support.
- Human‑Machine Interfaces (HMI) Devices requiring MIPI display and camera interfaces combined with application processing and control cores.
- Robotics & Infrastructure Embedded systems for robotics, building management, and infrastructure where simultaneous application and real‑time tasks are necessary.
- Smart Appliances & Edge Devices Edge devices performing local processing, networking, and secure communications in home or commercial appliances.
Unique Advantages
- Heterogeneous dual‑core architecture: Combines an ARM® Cortex®‑A55 and an ARM® Cortex®‑M33 to address both high‑level application workloads and real‑time control tasks within a single device.
- Integrated connectivity: Dual gigabit Ethernet, USB 2.0, CANbus and MIPI interfaces reduce external components and simplify system design for networked embedded products.
- Robust security primitives: On‑chip AES, RSA, SHA variants and TRNG enable device‑level cryptography and secure key generation without external security ICs.
- Memory flexibility: Support for DDR3L and DDR4 memory interfaces allows designers to match system memory performance and cost to application needs.
- Industrial readiness: Industrial temperature qualification and a compact 456‑LFBGA package facilitate deployment in harsh and space‑constrained environments.
- Platform and ecosystem support: Part of the Renesas RZ family with documented development environments for Linux and RTOS and ecosystem partner support for system development.
Why Choose R9A07G044L13GBG#BC0?
The R9A07G044L13GBG#BC0 positions itself as a versatile embedded MPU for designers who need a combination of application processing and deterministic control in industrial and edge environments. With dual cores from the ARM family, integrated interfaces for networking, display and field communications, and hardware security features, it offers a compact, integrated building block for connected devices.
Its industrial temperature rating, RoHS compliance, and placement in the Renesas RZ family ensure access to development tools, software ecosystems, and partner solutions that support scalable, long‑lifecycle designs and reliable deployment in fielded systems.
Request a quote or submit an inquiry to obtain pricing, lead‑time and availability for the R9A07G044L13GBG#BC0 and to discuss how it fits your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016