R9A07G044L13GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 166 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G044L13GBG#BC0 – ARM® Cortex®-A55 / Cortex®-M33 2‑Core 64‑Bit MPU (200 MHz / 1.2 GHz), 456‑LFBGA

The R9A07G044L13GBG#BC0 is a dual‑core microprocessor from Renesas' RZ/G2L family featuring ARM® Cortex®‑A55 and ARM® Cortex®‑M33 cores. It targets embedded and edge applications that require combined application processing and real‑time control, offering a heterogeneous 64‑bit/32‑bit architecture with listed clock rates of 1.2 GHz and 200 MHz.

Designed for industrial environments, the device integrates a range of system interfaces and security functions to support networked edge devices, human‑machine interfaces, and industrial control systems while operating across an extended temperature range.

Key Features

  • Cores and Architecture  ARM® Cortex®‑A55 and ARM® Cortex®‑M33 dual‑core configuration; the part is described with clock rates of 1.2 GHz and 200 MHz and a 64‑bit core capability.
  • Co‑processor  Includes ARM® Mali‑G31 listed as a co‑processor.
  • Memory Controllers  Integrated controllers for DDR3L and DDR4 memory types to support system memory requirements.
  • Display Interfaces  MIPI interfaces including CSI and DSI are provided for camera and display connectivity.
  • Networking and USB  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports for wired networking and peripheral connectivity.
  • Vehicle/Field Bus  CANbus interface included for control and field communications.
  • Security  Hardware security primitives including AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG for secure key generation and cryptographic operations.
  • Package and Mounting  456‑LFBGA (15×15) surface‑mount package for compact board integration.
  • Operating Range  Industrial temperature qualification with an operating temperature range of −40 °C to 85 °C.
  • Compliance  RoHS‑compliant product.
  • Graphics Acceleration  Graphics acceleration field is listed as "No" in the provided specifications.

Typical Applications

  • Industrial Automation  Edge controllers and machine interfaces that require industrial‑grade temperature operation, Ethernet connectivity, and field bus support.
  • Human‑Machine Interfaces (HMI)  Devices requiring MIPI display and camera interfaces combined with application processing and control cores.
  • Robotics & Infrastructure  Embedded systems for robotics, building management, and infrastructure where simultaneous application and real‑time tasks are necessary.
  • Smart Appliances & Edge Devices  Edge devices performing local processing, networking, and secure communications in home or commercial appliances.

Unique Advantages

  • Heterogeneous dual‑core architecture: Combines an ARM® Cortex®‑A55 and an ARM® Cortex®‑M33 to address both high‑level application workloads and real‑time control tasks within a single device.
  • Integrated connectivity: Dual gigabit Ethernet, USB 2.0, CANbus and MIPI interfaces reduce external components and simplify system design for networked embedded products.
  • Robust security primitives: On‑chip AES, RSA, SHA variants and TRNG enable device‑level cryptography and secure key generation without external security ICs.
  • Memory flexibility: Support for DDR3L and DDR4 memory interfaces allows designers to match system memory performance and cost to application needs.
  • Industrial readiness: Industrial temperature qualification and a compact 456‑LFBGA package facilitate deployment in harsh and space‑constrained environments.
  • Platform and ecosystem support: Part of the Renesas RZ family with documented development environments for Linux and RTOS and ecosystem partner support for system development.

Why Choose R9A07G044L13GBG#BC0?

The R9A07G044L13GBG#BC0 positions itself as a versatile embedded MPU for designers who need a combination of application processing and deterministic control in industrial and edge environments. With dual cores from the ARM family, integrated interfaces for networking, display and field communications, and hardware security features, it offers a compact, integrated building block for connected devices.

Its industrial temperature rating, RoHS compliance, and placement in the Renesas RZ family ensure access to development tools, software ecosystems, and partner solutions that support scalable, long‑lifecycle designs and reliable deployment in fielded systems.

Request a quote or submit an inquiry to obtain pricing, lead‑time and availability for the R9A07G044L13GBG#BC0 and to discuss how it fits your next embedded design.

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