R9A07G044C26GBG#BC0

The R9A07G044C26GBG#BC0 is a Renesas RZ/G2LC microprocessor IC featuring a 3‑core, 64‑bit architecture built around ARM® Cortex®‑A55 and ARM® Cortex®‑M33 cores. The device supports operating frequencies of 200 MHz and 1.2 GHz and is supplied in a compact 361‑BGA (13×13) surface‑mount package for embedded and industrial applications.

Designed for edge and embedded systems, this MPU combines multi‑core processing with integrated peripherals and security functions to support industrial networking, HMI and edge processing tasks where performance, integration and industrial qualification matter.

Key Features

• Core Architecture  ARM® Cortex®‑A55 and ARM® Cortex®‑M33 three‑core, 64‑bit configuration with supported operating frequencies of 200 MHz and 1.2 GHz.
• Co‑processor  ARM® Mali‑G31 co‑processor included for offloading parallel compute tasks.
• Memory Controllers  On‑chip controllers for DDR3L and DDR4 memory, enabling flexible system memory choices for performance and cost tradeoffs.
• Display Interfaces  MIPI‑CSI and MIPI‑DSI display interface controllers for camera and display subsystem integration in HMI and vision applications.
• High‑speed Networking & USB  Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 ports for robust connectivity and peripheral support.
• Automotive/Industrial Fieldbus  CANbus interface support for industrial control and vehicle network integration.
• Security  Built‑in hardware security features including AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG to support secure boot, encryption and integrity checks.
• Package & Mounting  361‑LFBGA / 361‑BGA (13×13) surface mount package suitable for compact embedded board designs.
• Industrial Qualification  Specified for industrial operation with an operating temperature range of −40°C to 85°C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Edge controllers and industrial gateways leveraging dual Gigabit Ethernet and CANbus for real‑time networking and device interfacing.
• Human‑Machine Interfaces (HMI)  Display and camera interface support (MIPI‑DSI/CSI) for high‑resolution control panels and visual operator interfaces.
• Robotics and Motion Control  Multi‑core processing and secure compute for sensor fusion, control logic and networked coordination in robotic systems.
• Edge AI and Image Processing  Co‑processor and high‑speed memory interfaces to accelerate image analysis and edge inference workloads.
• Infrastructure & Building Management  Networked edge devices and gateways that require industrial temperature range, security and robust connectivity.

Unique Advantages

• Multi‑core 64‑bit design: Combines Cortex‑A55 and Cortex‑M33 cores to separate application and real‑time tasks while scaling compute performance across workloads.
• Integrated security primitives: Hardware AES, RSA, SHA family and TRNG provide on‑chip cryptographic building blocks to simplify secure system design.
• Flexible memory support: DDR3L and DDR4 controller compatibility allows designers to select memory technologies that match performance and cost targets.
• Rich connectivity: Dual Gigabit Ethernet, USB 2.0 and CANbus support diverse networking and peripheral requirements without external bridges.
• Industrial readiness: Qualified for operation from −40°C to 85°C and supplied in a compact surface‑mount 361‑BGA package for reliable deployment in embedded systems.
• Ecosystem alignment: Part of the Renesas RZ family of microprocessors suited for edge intelligence and HMI use cases described in the RZ family documentation.

Why Choose R9A07G044C26GBG#BC0?

The R9A07G044C26GBG#BC0 positions itself as a versatile, industrial‑grade MPU that brings multi‑core 64‑bit processing, integrated security, and broad connectivity to edge and embedded designs. Its support for DDR3L/DDR4 memory, dual Gigabit Ethernet and MIPI display/camera interfaces makes it well suited for HMI, industrial networking, and edge processing applications.

For engineers targeting scalable, secure and connected embedded systems, this Renesas RZ/G2LC part delivers a compact package, industrial temperature qualification and RoHS compliance—enabling long‑term deployment in a wide range of edge device designs.

Request a quote or submit a pricing inquiry to begin evaluating R9A07G044C26GBG#BC0 for your next embedded or industrial design project.