R9A07G044C22GBG#YJ0

IC MPU RZ 200MHZ/1.2GHZ 361BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2LC 3 Core, 64-Bit 200MHz, 1.2GHz 361-BGA (13x13)

Quantity 88 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package361-BGA (13×13)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G044C22GBG#YJ0 – IC MPU RZ 200MHZ/1.2GHZ 361BGA

The R9A07G044C22GBG#YJ0 is a Renesas RZ/G2LC series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit configuration. The product listing identifies operating points at 200 MHz and 1.2 GHz, delivering a combination of application-class processing and real-time control capability tailored for embedded and industrial edge devices.

Designed for industrial applications, this MPU integrates high-speed network interfaces, multiple display and camera controllers, memory interface flexibility, and hardware security primitives—making it suitable for connected HMI, control, and edge processing applications where integration and reliability are important.

Key Features

  • Core architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit configuration; operating points cited at 200 MHz and 1.2 GHz in the product listing.
  • Co-processor DSP  Includes an ARM® Mali‑G31 listed as a co-processor DSP for offloading specialized processing tasks.
  • Memory interfaces  Integrated controllers for DDR3L and DDR4 memory to support system memory requirements and flexible BOM choices.
  • Display and camera  MIPI/CSI and MIPI/DSI display interface controllers enable connection of camera sensors and modern display panels.
  • Networking and USB  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 interfaces provide robust wired connectivity options.
  • Additional interfaces  CANbus support and other standard peripheral interfaces for industrial I/O and field connectivity.
  • Security features  Hardware security primitives including AES, RSA, SHA‑1, SHA‑224, SHA‑256 and a TRNG for cryptographic operations and key generation.
  • Industrial qualification and temperature range  Qualification: Industrial; rated operating temperature from −40 °C to 85 °C for deployment in industrial environments.
  • Package and mounting  361‑ball LFBGA / 361‑BGA (13 × 13) supplier device package; surface‑mount package for compact, board‑level integration.
  • RoHS compliance  RoHS status: Compliant.

Typical Applications

  • Industrial HMI and control  Drives high‑resolution displays and camera inputs while providing real‑time control capability for embedded HMIs and operator panels.
  • Edge network appliances  Dual gigabit Ethernet and USB interfaces enable use in edge routers, gateways, and networked controllers requiring robust wired connectivity.
  • Machine vision and sensing  MIPI/CSI camera interfaces combined with on‑chip processing cores support edge image capture and preprocessing tasks in industrial inspection or monitoring.
  • CAN‑connected control systems  CANbus interface and real‑time core support integration into motor control, motion systems, and fieldbus‑enabled equipment.

Unique Advantages

  • Integrated multicore processing: Combines application and real‑time cores (Cortex‑A55 + Cortex‑M33) in a single device to consolidate system architecture and simplify software partitioning.
  • Broad wired connectivity: Dual 1 GbE ports plus USB 2.0 and CANbus enable flexible network and peripheral topologies for industrial and edge designs.
  • Hardware security primitives: On‑chip AES, RSA, SHA variants and TRNG provide a foundation for secure boot, encryption, and cryptographic services without external accelerators.
  • Flexible memory support: DDR3L and DDR4 memory controllers allow designers to match performance and cost targets across applications.
  • Industrial readiness: Industrial qualification and a −40 °C to 85 °C operating range support deployment in harsh or temperature‑varying environments.
  • Compact surface‑mount package: 361‑ball BGA (13 × 13) package enables dense board layouts and integration into space‑constrained systems.

Why Choose R9A07G044C22GBG#YJ0?

The R9A07G044C22GBG#YJ0 positions itself as a versatile MPU for embedded and industrial edge systems that require a mix of application processing, deterministic control, and secure connectivity. Its combination of ARM® Cortex® cores, flexible memory interfaces, multiple wired network ports, and hardware security features delivers a compact, integrated platform for systems engineering.

This part is suitable for designs where industrial qualification, a broad peripheral set, and integration within the Renesas RZ family development environment are priorities—helping reduce system BOM and accelerate time to market while maintaining deployment robustness over typical industrial temperature ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the R9A07G044C22GBG#YJ0. Our team can provide the details you need to evaluate this MPU in your next embedded or industrial design.

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