R9A07G044C16GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 361BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2LC 2 Core, 64-Bit 200MHz, 1.2GHz 361-BGA (13x13)

Quantity 124 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1.2GHzSupplier Device Package361-BGA (13×13)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G044C16GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 361BGA

The R9A07G044C16GBG#BC0 is a Renesas RZ/G2LC microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2-core, 64-bit configuration. It combines application-class processing with a microcontroller-class core to address edge device requirements in industrial and embedded systems.

Designed for edge and embedded markets, this industrial-qualified MPU integrates high-speed interfaces, memory controllers, and hardware security primitives to support connected HMI, industrial control, and networked equipment with a compact 361-ball BGA (13 × 13 mm) footprint.

Key Features

  • Core Architecture  The device pairs an ARM® Cortex®-A55 with an ARM® Cortex®-M33 in a 2-core, 64-bit arrangement providing application and control processing in one package.
  • Operating Frequency  Documented core speeds include 200 MHz and 1.2 GHz as provided in the product description.
  • Graphics/DSP  Includes an ARM® Mali-G31 listed as a co-processor DSP in the product specifications.
  • Memory Interfaces  Integrated memory controllers for DDR3L and DDR4 to support external system memory.
  • Display and Camera Interfaces  MIPI/CSI and MIPI/DSI display interface controllers are provided for camera and display connectivity.
  • Ethernet & USB  Two 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports enable wired networking and standard peripheral connectivity.
  • Additional Field Interfaces  CANbus is available for automotive-style or industrial fieldbus integration.
  • Security Features  On-chip security primitives include AES, RSA, SHA-1, SHA-224, SHA-256 and a TRNG to support cryptographic functions and secure key generation.
  • Package & Mounting  Supplied in a 361-LFBGA / 361-BGA (13×13 mm) package intended for surface-mount assembly.
  • Qualification & Environmental  Industrial qualification and RoHS compliance; operating temperature range is −40 °C to 85 °C.

Typical Applications

  • Industrial Control & Automation  Two gigabit Ethernet ports and field interfaces such as CANbus make this MPU suitable for networked control systems and industrial communication equipment.
  • Human‑Machine Interface (HMI)  MIPI/DSI display support and external memory controllers allow responsive user interfaces and display handling in embedded operator panels.
  • Imaging and Vision  MIPI/CSI camera interface and processing cores enable image capture and processing tasks in inspection and monitoring devices.
  • Edge Communication Gateways  Integrated Ethernet, USB and security primitives support secure edge gateways and protocol translation appliances.

Unique Advantages

  • Heterogeneous dual-core design: Combines ARM® Cortex®-A55 and Cortex®-M33 cores to consolidate application processing and control tasks in a single device.
  • Broad connectivity mix: Multiple Ethernet ports, USB 2.0, MIPI interfaces and CANbus reduce the need for external bridge components and simplify system architecture.
  • Security building blocks included: AES, RSA, SHA algorithms and a TRNG provide foundational crypto capabilities for secure communications and authentication.
  • Memory flexibility: Support for DDR3L and DDR4 memory controllers lets designers choose memory technology that matches system cost and performance targets.
  • Industrial-ready thermal range: Rated for −40 °C to 85 °C operation to meet common industrial environment requirements.
  • Compact BGA package: 361-ball (13×13 mm) LFBGA keeps board area low while supporting high pin density for complex embedded designs.

Why Choose R9A07G044C16GBG#BC0?

The R9A07G044C16GBG#BC0 positions itself as an integrated MPU solution for embedded and industrial edge applications that require a mix of application processing, control, security and network connectivity. Its dual-core ARM architecture, memory controller options, multiple Ethernet ports and hardware security features provide a balanced platform for connected HMI, imaging and industrial gateway applications.

As part of the Renesas RZ family, this device aligns with documented development environments and ecosystem resources for the RZ series, offering designers a pathway to scalable, supported embedded solutions for long-term deployments.

If you would like pricing, lead-time information or a formal quote for R9A07G044C16GBG#BC0, please request a quote or submit an inquiry to receive assistance from our team.

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