R9A07G044C12GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 361BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2LC 2 Core, 64-Bit 200MHz, 1.2GHz 361-BGA (13x13)

Quantity 1,506 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G044
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersMIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package361-BGA (13×13)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G044C12GBG#AC0 – IC MPU RZ 200MHz/1.2GHz 361-BGA

The R9A07G044C12GBG#AC0 is a Renesas RZ/G2LC 64-bit microprocessor featuring dual cores: an ARM® Cortex®-A55 and an ARM® Cortex®-M33. It combines general-purpose 64-bit application processing with a real-time MCU core to address edge device requirements for HMI, real-time control and connected industrial applications.

Designed for industrial-grade deployments, this MPU integrates high-speed interfaces, memory controllers and security engines to deliver a compact, integration-focused building block for embedded systems operating from −40 °C to 85 °C.

Key Features

  • Processing Cores  ARM® Cortex®-A55 and ARM® Cortex®-M33 dual-core architecture providing 64-bit application processing paired with a real-time control core.
  • Clock Domains  Dual-frequency operation indicated as 200 MHz for one domain and up to 1.2 GHz for the other, supporting mixed-performance workloads.
  • Graphics / DSP  ARM® Mali-G31 listed as a co-processor DSP to support graphics and media processing tasks.
  • Memory Interfaces  On-chip controllers for DDR3L and DDR4 memory types to support flexible system memory configurations.
  • Display and Camera  MIPI CSI and MIPI DSI display/camera interface controllers for HMI and vision applications.
  • Networking & USB  Two 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports for wired connectivity and peripheral support.
  • Fieldbus  CANbus interface for industrial and vehicle-area communication needs.
  • Security  Hardware security primitives including AES, RSA, SHA-1, SHA-224, SHA-256 and a TRNG for cryptographic and entropy needs.
  • Package & Mounting  361-LFBGA supplier device package (361-BGA, 13 × 13 mm) designed for surface-mount assembly.
  • Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 85 °C.
  • Compliance  RoHS compliant environmental status.

Typical Applications

  • Industrial Control  Use the dual-core MPU for HMI, real-time control and networked automation where deterministic control and application processing are required.
  • Edge Vision & AI Assist  MIPI camera interfaces and the Mali-G31 co-processor enable image input and processing workflows at the edge.
  • Building & Infrastructure Management  Dual gigabit Ethernet, CANbus and robust security features facilitate secure, connected building management and infrastructure monitoring.
  • Robotics & Autonomous Systems  Combine high-level decision-making on the Cortex-A55 with real-time tasks on the Cortex-M33 for coordinated control and sensor handling.

Unique Advantages

  • Dual-core, heterogeneous processing: Combines a 64-bit application core and a real-time MCU core to consolidate system functions and simplify partitioning of tasks.
  • Flexible memory support: DDR3L and DDR4 memory controllers allow designers to choose memory options that match performance and cost targets.
  • Broad connectivity: Built-in dual gigabit Ethernet, USB 2.0, MIPI display/camera interfaces and CANbus reduce the need for external bridges and minimize BOM size.
  • Integrated security building blocks: AES, RSA, multiple SHA variants and a TRNG provide hardware-level primitives for secure boot, communication and data protection.
  • Industrial readiness: Industrial qualification and an extended operating temperature range support deployment in harsh environments.
  • Compact package: 361-ball LFBGA (13 × 13 mm) balances I/O density with a small PCB footprint for space-constrained designs.

Why Choose R9A07G044C12GBG#AC0?

The R9A07G044C12GBG#AC0 positions itself as an integration-focused MPU for edge devices that require a mix of application-level processing and real-time control. Its combination of ARM® Cortex® cores, memory flexibility, wired networking, MIPI interfaces and hardware security enables consolidated designs that reduce external components while meeting industrial environmental requirements.

This device is well suited for designers building connected industrial, HMI, vision and robotics systems that demand secure, deterministic control alongside application processing. Backed by the RZ family development environment and ecosystem resources, it supports scalable implementation and longer-term product development.

Request a quote or contact our sales team to discuss volume pricing, availability and how R9A07G044C12GBG#AC0 can fit into your next embedded design.

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