R9A07G054L13GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 1,124 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L13GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA

The R9A07G054L13GBG#AC0 is a Renesas RZ/V2L microprocessor IC featuring a dual-core 64-bit architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. It integrates multimedia acceleration and a broad set of I/O and memory controllers targeted at industrial edge applications.

Designed for embedded systems requiring display, multimedia and network connectivity, this industrial-qualified device delivers a balance of processing and integration for human-machine interfaces, vision-capable edge devices and communication gateways.

Key Features

  • Dual-Core 64‑Bit Processing  Dual-core architecture combining ARM® Cortex®-A55 and ARM® Cortex®-M33 with operating points expressed as 200 MHz and 1.2 GHz.
  • Graphics & Multimedia Acceleration  Integrated ARM® Mali‑G31 graphics and NEON™ SIMD for multimedia processing and accelerated graphics tasks.
  • Memory Support  On-chip controllers for DDR3L and DDR4 memory to support mainstream system memory configurations.
  • Display & Camera Interfaces  Display interface controllers for LCD plus MIPI CSI and MIPI DSI connectivity for camera and panel support.
  • Ethernet & USB  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports for high-throughput wired networking and peripheral connectivity.
  • Automotive/Field Bus  CANbus interface for robust field-level communications in industrial environments.
  • Package & Mounting  456‑LFBGA package (15 × 15 mm) intended for surface mount assembly.
  • Industrial Qualification & Temperature Range  Industrial-grade qualification with operating temperature from −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Industrial Automation  Control and HMI systems that require a combination of real-time control and rich user interfaces, leveraging the Cortex‑M33 and Cortex‑A55 cores.
  • Human‑Machine Interfaces (HMI)  Graphic displays and touch panels using integrated graphics acceleration and MIPI/DSI or LCD interfaces.
  • Edge Vision & Multimedia  Camera-equipped edge devices and visual analysis applications utilizing MIPI/CSI, NEON SIMD and Mali‑G31 acceleration.
  • Networked Gateways  Industrial gateways and communication nodes requiring dual gigabit Ethernet, USB 2.0 and CANbus connectivity.

Unique Advantages

  • Balanced Dual‑Core Architecture: Combines a 64‑bit application core and an embedded control core to separate high-level processing from real‑time tasks.
  • Integrated Multimedia Subsystem: Mali‑G31 and NEON acceleration reduce the need for external graphics processors, simplifying BOM and board design.
  • Flexible Memory Options: Support for DDR3L and DDR4 enables designers to choose memory that best fits cost and performance targets.
  • Comprehensive Connectivity: Dual gigabit Ethernet, USB 2.0 and CANbus provide a wide set of interfaces for industrial and edge networking without extensive external bridging.
  • Industrial Provenance: Industrial qualification and extended temperature range provide suitability for field-deployed embedded systems.
  • Compact BGA Packaging: 456‑LFBGA (15×15 mm) offers a small footprint for space-constrained designs while supporting dense integration.

Why Choose R9A07G054L13GBG#AC0?

This Renesas RZ/V2L device positions itself for embedded designs that require a combination of application-level performance, real‑time control and rich multimedia/connectivity. Its dual‑core 64‑bit architecture, integrated graphics and extensive I/O make it suitable for industrial HMIs, edge vision systems and communication gateways.

With industrial qualification, broad memory interface support and an ecosystem of development resources for the RZ family, the R9A07G054L13GBG#AC0 offers a scalable and supported platform for long‑lifecycle embedded products.

Request a quote or submit an inquiry for R9A07G054L13GBG#AC0 to receive pricing, availability and ordering information. Include your quantity and target lead time for the fastest response.

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