R9A07G054L14GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 157 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L14GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G054L14GBG#BC0 is a dual-core microprocessor IC from Renesas' RZ/V2L family featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 architectures. The device is presented with listed speeds of 200 MHz and 1.2 GHz and targets edge and embedded applications that require integrated multimedia, networking, and real-time control functions.

Designed for industrial qualification and surface-mount deployment, this MPU integrates graphics and multimedia acceleration alongside high-speed interfaces and DDR memory support to address HMI, industrial networking, and advanced edge processing use cases.

Key Features

  • Core Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 dual-core configuration supporting 64-bit operation.
  • Performance Profiles  Listed operating speeds include 200 MHz and 1.2 GHz to cover control and higher-performance processing tasks.
  • Graphics & Multimedia  Integrated ARM® Mali-G31 and NEON™ SIMD for multimedia and graphics acceleration.
  • Memory Support  On-chip controllers for DDR3L and DDR4 memory types to support system memory requirements.
  • Display & Camera Interfaces  Display and image interfaces including LCD, MIPI/CSI, and MIPI/DSI for high-resolution HMI and camera connectivity.
  • Networking & Connectivity  Dual 10/100/1000 Mbps Ethernet ports, USB 2.0 (2 ports), and CANbus for robust field and industrial networking.
  • Package & Mounting  551-LFBGA package (21×21 mm) optimized for surface-mount PCB assembly.
  • Operating Range & Qualification  Industrial qualification with operating temperature range of −40°C to 85°C.

Typical Applications

  • Industrial HMI and Control  Drives advanced human-machine interfaces and local control tasks using integrated graphics and display interfaces.
  • Edge Image and Multimedia Processing  Supports camera input via MIPI/CSI and multimedia acceleration for on-device image analysis and video processing.
  • Industrial Networking & Gateways  Dual gigabit Ethernet and CANbus interfaces enable real-time network communication and protocol bridging at the edge.
  • Embedded Appliances & Robotics  Combines general-purpose 64-bit processing and real-time control capability suitable for intelligent appliance and robotic subsystems.

Unique Advantages

  • Dual-core, heterogeneous processing: Combines ARM Cortex-A55 and Cortex-M33 cores to separate application-class processing from real-time control tasks.
  • Integrated multimedia acceleration: Mali-G31 and NEON SIMD reduce external graphics and processing requirements for HMI and image workloads.
  • Broad interface set: Ethernet, USB, CANbus and multiple display/camera interfaces simplify system integration and reduce BOM complexity.
  • Flexible memory support: DDR3L and DDR4 controller support enables designers to right-size system memory for performance and cost.
  • Industrial-grade operation: Specified for −40°C to 85°C and industrial qualification for deployment in harsh field environments.
  • BGA package for dense designs: 551-LFBGA (21×21 mm) supports compact PCB layouts while maintaining high I/O density.

Why Choose R9A07G054L14GBG#BC0?

The R9A07G054L14GBG#BC0 positions itself as a versatile MPU for edge and embedded systems that require a mix of application-level processing, real-time control, multimedia, and networking. Its combination of ARM® Cortex® cores, graphics acceleration, and a comprehensive set of interfaces makes it suitable for designs that need integrated functionality without excessive external components.

For development teams focused on industrial HMI, imaging, gateway, or appliance applications, this device offers a balance of performance, interface density, and industrial qualification that supports scalable designs and long-term deployment.

Request a quote or submit an inquiry to obtain pricing, availability, and support for integrating the R9A07G054L14GBG#BC0 into your next embedded design.

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