R9A07G054L18GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 1,877 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L18GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G054L18GBG#AC0 is a dual-core microprocessor IC in the RZ/V2L family featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. It provides a 64-bit, dual-core architecture with operating points noted at 200 MHz and 1.2 GHz, designed for embedded and industrial applications.

This device integrates multimedia acceleration and broad I/O support—including display controllers, multiple Ethernet ports, USB, and CANbus—targeting connected embedded systems that require both general-purpose processing and real-time control in an industrial temperature range.

Key Features

  • Core Architecture  Dual-core design combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores for a mix of application and real-time processing in a 64-bit architecture.
  • Performance Points  Documented operating points include 200 MHz and 1.2 GHz to support varied processing loads.
  • Graphics and Multimedia  Integrated ARM® Mali-G31 graphics acceleration and NEON™ SIMD for multimedia processing and parallel compute tasks.
  • Memory Support  On-chip controllers compatible with DDR3L and DDR4 memory interfaces to support system memory requirements.
  • Display Interfaces  Built-in display interface controllers including LCD, MIPI/CSI and MIPI/DSI to drive modern displays and camera inputs.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet ports, dual USB 2.0 ports, and CANbus support provide versatile wired connectivity options.
  • Industrial Qualification & Temperature Range  Industrial-qualified device rated for operation from −40 °C to 85 °C for deployment in demanding environments.
  • Package & Mounting  551-LFBGA package (21×21 mm) optimized for surface-mount PCB integration.
  • Regulatory  RoHS compliant.

Typical Applications

  • Embedded Industrial Systems  Use the dual-core 64-bit architecture and industrial temperature rating for control and processing tasks in industrial equipment.
  • Connected Multimedia Devices  Leverage the Mali-G31 graphics accelerator, NEON SIMD, and display interfaces for multimedia playback and camera interfacing in embedded products.
  • Networked Controllers  Dual Gigabit Ethernet and CANbus support enable networked control and communication in automation and IoT gateways.
  • Human–Machine Interfaces (HMI)  Integrate LCD and MIPI display controllers with the processor’s graphics capabilities for responsive user interfaces.

Unique Advantages

  • Dual-Core 64‑Bit Flexibility: Combines ARM® Cortex®-A55 and Cortex®-M33 to separate application-level and real-time workloads.
  • Integrated Multimedia Acceleration: Mali-G31 and NEON™ SIMD deliver hardware-accelerated graphics and SIMD compute without adding external accelerators.
  • Broad Memory Compatibility: DDR3L and DDR4 controller support simplifies integration across different memory choices.
  • Comprehensive I/O Suite: Multiple Ethernet ports, USB 2.0, CANbus and display interfaces reduce external bridge components and simplify system design.
  • Industrial Temperature Rating: −40 °C to 85 °C qualification supports deployment in harsh and varied environmental conditions.
  • Compact BGA Package: 551-LFBGA (21×21 mm) surface-mount package enables high-density PCB layouts.

Why Choose R9A07G054L18GBG#AC0?

The R9A07G054L18GBG#AC0 positions itself as a versatile embedded microprocessor combining application-class and real-time cores with integrated multimedia and extensive connectivity. Its mix of ARM® Cortex®-A55 and Cortex®-M33 cores, supported memory interfaces, and graphics acceleration make it suitable for designs that need both compute performance and multimedia capability within industrial operating conditions.

This device is well suited for designers building connected, display-rich, or networked embedded products where integration, temperature robustness, and a broad peripheral set reduce system complexity and bill of materials.

Request a quote or submit an inquiry to learn more about availability and pricing for R9A07G054L18GBG#AC0. Our team can provide lead-time and ordering information to support your design schedule.

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