R9A07G054L18GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21) |
|---|---|
| Quantity | 1,877 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G054 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 551-LFBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, MIPI/CSI, MIPI/DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 551-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz, 1.2GHz | ||
| Supplier Device Package | 551-LFBGA (21×21) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G054L18GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA
The R9A07G054L18GBG#AC0 is a dual-core microprocessor IC in the RZ/V2L family featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. It provides a 64-bit, dual-core architecture with operating points noted at 200 MHz and 1.2 GHz, designed for embedded and industrial applications.
This device integrates multimedia acceleration and broad I/O support—including display controllers, multiple Ethernet ports, USB, and CANbus—targeting connected embedded systems that require both general-purpose processing and real-time control in an industrial temperature range.
Key Features
- Core Architecture Dual-core design combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores for a mix of application and real-time processing in a 64-bit architecture.
- Performance Points Documented operating points include 200 MHz and 1.2 GHz to support varied processing loads.
- Graphics and Multimedia Integrated ARM® Mali-G31 graphics acceleration and NEON™ SIMD for multimedia processing and parallel compute tasks.
- Memory Support On-chip controllers compatible with DDR3L and DDR4 memory interfaces to support system memory requirements.
- Display Interfaces Built-in display interface controllers including LCD, MIPI/CSI and MIPI/DSI to drive modern displays and camera inputs.
- Connectivity Dual 10/100/1000 Mbps Ethernet ports, dual USB 2.0 ports, and CANbus support provide versatile wired connectivity options.
- Industrial Qualification & Temperature Range Industrial-qualified device rated for operation from −40 °C to 85 °C for deployment in demanding environments.
- Package & Mounting 551-LFBGA package (21×21 mm) optimized for surface-mount PCB integration.
- Regulatory RoHS compliant.
Typical Applications
- Embedded Industrial Systems Use the dual-core 64-bit architecture and industrial temperature rating for control and processing tasks in industrial equipment.
- Connected Multimedia Devices Leverage the Mali-G31 graphics accelerator, NEON SIMD, and display interfaces for multimedia playback and camera interfacing in embedded products.
- Networked Controllers Dual Gigabit Ethernet and CANbus support enable networked control and communication in automation and IoT gateways.
- Human–Machine Interfaces (HMI) Integrate LCD and MIPI display controllers with the processor’s graphics capabilities for responsive user interfaces.
Unique Advantages
- Dual-Core 64‑Bit Flexibility: Combines ARM® Cortex®-A55 and Cortex®-M33 to separate application-level and real-time workloads.
- Integrated Multimedia Acceleration: Mali-G31 and NEON™ SIMD deliver hardware-accelerated graphics and SIMD compute without adding external accelerators.
- Broad Memory Compatibility: DDR3L and DDR4 controller support simplifies integration across different memory choices.
- Comprehensive I/O Suite: Multiple Ethernet ports, USB 2.0, CANbus and display interfaces reduce external bridge components and simplify system design.
- Industrial Temperature Rating: −40 °C to 85 °C qualification supports deployment in harsh and varied environmental conditions.
- Compact BGA Package: 551-LFBGA (21×21 mm) surface-mount package enables high-density PCB layouts.
Why Choose R9A07G054L18GBG#AC0?
The R9A07G054L18GBG#AC0 positions itself as a versatile embedded microprocessor combining application-class and real-time cores with integrated multimedia and extensive connectivity. Its mix of ARM® Cortex®-A55 and Cortex®-M33 cores, supported memory interfaces, and graphics acceleration make it suitable for designs that need both compute performance and multimedia capability within industrial operating conditions.
This device is well suited for designers building connected, display-rich, or networked embedded products where integration, temperature robustness, and a broad peripheral set reduce system complexity and bill of materials.
Request a quote or submit an inquiry to learn more about availability and pricing for R9A07G054L18GBG#AC0. Our team can provide lead-time and ordering information to support your design schedule.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016