R9A07G054L23GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC - 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15) |
|---|---|
| Quantity | 889 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G054 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 456-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 456-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz, 1.2GHz | ||
| Supplier Device Package | 456-LFBGA (15×15) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G054L23GBG#AC0 – IC MPU 200MHZ/1.2GHZ 456LFBGA
The R9A07G054L23GBG#AC0 is a Renesas microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration. It combines multicore processing with dedicated multimedia and graphics acceleration to address embedded and industrial applications.
Designed for integration into embedded systems, this device offers on-chip multimedia engines, multiple high-speed interfaces, and support for common DDR memory types, enabling compact, connected designs that operate across an industrial temperature range.
Key Features
- Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit arrangement with operating points cited at 200 MHz and 1.2 GHz.
- Graphics and Multimedia ARM® Mali-G31 GPU, multimedia engines and NEON™ SIMD acceleration for enhanced graphics and media processing; graphics acceleration is supported.
- Memory Support Integrated controllers for DDR3L and DDR4 memory to support system memory requirements.
- Display Interfaces Built-in controllers for LCD, MIPI/CSI and MIPI/DSI display paths for modern user interfaces and camera connectivity.
- Connectivity Dual Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports and CANbus provide a range of wired networking and peripheral options.
- Package and Mounting 456-LFBGA surface-mount package (15 × 15 mm) for high-density board integration.
- Operating Range & Qualification Industrial-qualified device rated for operation from −40 °C to 85 °C; RoHS compliant.
Typical Applications
- Industrial Control — Real-time control and monitoring systems that benefit from a combination of Cortex-M33 control processing and connectivity options such as CANbus and Ethernet.
- Human–Machine Interfaces (HMI) — Graphical displays and touch interfaces using LCD or MIPI/DSI with Mali-G31 graphics acceleration for smooth UI rendering.
- Embedded Networking — Gateways, edge nodes and communication devices leveraging dual Gigabit Ethernet and USB 2.0 for wired connectivity.
- Video and Imaging — Camera and display-enabled products using MIPI/CSI and multimedia accelerators for image capture and processing.
Unique Advantages
- Multicore, mixed-architecture design: Combines Cortex-A55 and Cortex-M33 cores in a 3-core, 64-bit arrangement to address both application processing and real-time tasks.
- Integrated multimedia and graphics: Mali-G31 and NEON SIMD provide on-chip acceleration for graphics and media workflows, reducing external component needs.
- Broad memory compatibility: DDR3L and DDR4 controller support enables flexible memory subsystem design choices.
- Comprehensive I/O: Dual Gigabit Ethernet, USB 2.0, MIPI display/camera interfaces and CANbus offer a wide set of connectivity options for embedded systems.
- Industrial temperature rating: −40 °C to 85 °C operation suitable for industrial environments and extended-temperature deployments.
- High-density package: 456-LFBGA (15×15 mm) supports compact board layouts while accommodating extensive I/O and processing capability.
Why Choose R9A07G054L23GBG#AC0?
The R9A07G054L23GBG#AC0 positions itself as a tightly integrated embedded microprocessor that balances application-level compute, real-time control and multimedia acceleration. With ARM® Cortex® cores, an on-chip Mali GPU, extensive interface options and DDR memory support, it is suited to designs that require both connectivity and rich user interfaces under industrial temperature conditions.
This device is ideal for engineers and designers building industrial embedded systems, HMI platforms, networking equipment and imaging applications that need a compact, feature-rich MPU with broad I/O and memory flexibility. Selecting this part supports scalable designs within the R9A07G054 series and leverages Renesas’ product offering for long-term deployment needs.
Request a quote or submit an inquiry to learn more about availability, pricing and how R9A07G054L23GBG#AC0 can fit your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016