R9A07G054L27GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 774 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCN5A002A RENEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L27GBG#AC0 – ARM® Cortex®-A55 / Cortex®-M33 3‑Core 64‑Bit Microprocessor

The R9A07G054L27GBG#AC0 is a Renesas RZ/V2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit configuration. It combines application-class processing and a real-time microcontroller core with integrated graphics and multimedia co-processors to address embedded and industrial use cases.

Designed for industrial environments, the device delivers high integration for display, networking and peripheral connectivity while supporting standard DDR3L/DDR4 memory and a compact 456‑LFBGA (15×15) surface‑mount package.

Key Features

  • Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit arrangement providing application and real‑time processing on a single device. The description references operating points of 200 MHz and 1.2 GHz.
  • Graphics and Multimedia Integrated ARM® Mali‑G31 graphics and NEON™ SIMD multimedia support for accelerated graphics and media processing; graphics acceleration is explicitly indicated.
  • Memory Support Supports DDR3L and DDR4 memory controllers to match a range of system memory designs and performance needs.
  • Display and Camera Interfaces Built‑in controllers for LCD, MIPI/CSI and MIPI/DSI enable high‑quality display and camera connectivity for HMI and vision applications.
  • Networking and I/O Dual 10/100/1000 Mbps Ethernet ports, dual USB 2.0 ports and CANbus provide versatile wired connectivity for industrial networks and peripheral integration.
  • Package and Mounting Compact 456‑LFBGA (15×15) package in a surface‑mount form factor suited for space‑constrained embedded PCBs.
  • Industrial Qualification and Temperature Range Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • Industrial HMI and Displays — Leverages LCD and MIPI/DSI controllers plus graphics acceleration to drive user interfaces and operator panels.
  • Vision and Multimedia Modules — MIPI/CSI camera input and Mali‑G31 multimedia support enable camera processing and multimedia playback.
  • Industrial Networking Gateways — Dual Gigabit Ethernet and CANbus support robust connectivity for industrial automation and gateway applications.
  • Embedded Control Systems — Combined Cortex‑A and Cortex‑M cores provide a platform for mixed application and real‑time control workloads.

Unique Advantages

  • Highly integrated processing — Combines application (Cortex‑A55) and real‑time (Cortex‑M33) cores with graphics and multimedia co‑processors to reduce system BOM and simplify design partitioning.
  • Flexible memory interface — DDR3L and DDR4 controller support allows designers to choose memory options that balance cost and performance.
  • Comprehensive connectivity — Dual Gigabit Ethernet, USB 2.0 and CANbus provide multiple standard interfaces for networking and peripheral integration.
  • Industrial readiness — Industrial qualification and −40 °C to 85 °C operating range support deployment in demanding environments.
  • Compact system footprint — 456‑LFBGA (15×15) surface‑mount package enables compact board layouts for space‑constrained products.
  • Standards‑aligned supply — RoHS compliance supports regulatory requirements for electronics manufacturing.

Why Choose R9A07G054L27GBG#AC0?

R9A07G054L27GBG#AC0 positions itself as a multi‑domain embedded processor that brings application processing, real‑time control and multimedia capabilities into a single, industrially qualified device. Its combination of ARM® Cortex® cores, graphics acceleration, flexible memory interfaces and comprehensive I/O makes it suitable for embedded designs that require both performance and integration.

Ideal for engineering teams developing industrial HMIs, vision systems, networking gateways or mixed‑control embedded platforms, this Renesas part offers a scalable foundation with a compact package and extended operating temperature range for reliable long‑term deployments.

Request a quote or submit a purchase inquiry for R9A07G054L27GBG#AC0 to discuss pricing, availability and volume options with our sales team.

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