R9A07G054L23GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 64 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCN3A991A2Ethernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L23GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA

The R9A07G054L23GBG#BC0 is a Renesas RZ/V2L series microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit architecture. It provides heterogeneous processing capability with listed core frequencies of 200 MHz and 1.2 GHz, targeted at embedded and industrial applications.

Designed for edge devices and industrial systems, the device combines CPU cores, graphics and multimedia co-processors, multiple high-speed interfaces and DDR memory controllers to support HMI, vision, networking and real-time control use cases while operating across an industrial temperature range.

Key Features

  • CPU Cores  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration; listed frequencies include 200 MHz and 1.2 GHz.
  • Graphics & Multimedia  Includes an ARM® Mali-G31 GPU and NEON™ SIMD for multimedia acceleration and graphics processing.
  • Memory Support  Integrated controllers for DDR3L and DDR4 memory types to support system memory requirements.
  • Display Interfaces  Built-in display interface controllers including LCD, MIPI/CSI and MIPI/DSI for high-quality HMI and camera connectivity.
  • Networking & USB  Dual Gigabit Ethernet ports (10/100/1000 Mbps ×2) and two USB 2.0 ports for wired networking and peripheral connectivity.
  • Automotive/Industrial I/O  Includes CANbus as an additional interface for industrial field connectivity.
  • Package & Mounting  456-LFBGA (15×15) package, surface-mount suitable for compact embedded designs.
  • Operating Range  Industrial-grade operating temperature range from −40°C to 85°C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Use the multi-core processor and dual Gigabit Ethernet for real-time control, industrial networking and edge compute tasks.
  • Human–Machine Interfaces (HMI)  On-chip display controllers and graphics acceleration enable responsive, feature-rich operator interfaces.
  • Machine Vision & Multimedia  MIPI camera interfaces and NEON™/Mali-G31 acceleration support image processing and multimedia workflows at the edge.
  • Robotics & Autonomous Equipment  Heterogeneous processing and CANbus connectivity help integrate sensor processing, control and communication in compact systems.

Unique Advantages

  • Heterogeneous 3‑core Architecture: Combines ARM® Cortex®-A55 and Cortex®-M33 cores for split workloads—application-level processing and real-time control—within one device.
  • Integrated Graphics & SIMD Acceleration: Mali‑G31 GPU and NEON™ SIMD provide hardware acceleration for graphics and multimedia tasks, reducing CPU load.
  • Flexible Memory Support: DDR3L and DDR4 memory controller support allows designers to choose memory suited to performance and power targets.
  • Robust Industrial I/O: Dual Gigabit Ethernet, USB 2.0 ports and CANbus expand connectivity options for industrial networks and peripherals.
  • Industrial Temperature Qualification: Specified operation from −40°C to 85°C supports deployment in harsh and temperature-variable environments.
  • Compact, Surface‑Mount Package: 456‑LFBGA (15×15) package provides high integration density for space-constrained embedded designs.

Why Choose R9A07G054L23GBG#BC0?

This Renesas RZ/V2L microprocessor part balances multi-core processing, graphics/multimedia acceleration and comprehensive I/O in an industrial-grade package, making it suitable for embedded edge systems that require mixed application and control processing. Its DDR3L/DDR4 memory support, dual Gigabit Ethernet and MIPI display/camera interfaces enable compact, connected HMIs, vision systems and automation controllers.

As part of the RZ family, the device benefits from Renesas' ecosystem and development environment options for embedded Linux and RTOS workflows, helping teams move from prototype to production with established toolchains and resources.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for R9A07G054L23GBG#BC0.

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