R9A07G054L24GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC - 3 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21) |
|---|---|
| Quantity | 351 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G054 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 551-LFBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, MIPI/CSI, MIPI/DSI | ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 551-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz, 1.2GHz | ||
| Supplier Device Package | 551-LFBGA (21×21) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G054L24GBG#AC0 – 3‑Core ARM® Cortex®‑A55 / Cortex®‑M33 MPU, 200 MHz / 1.2 GHz, 551‑LFBGA
The R9A07G054L24GBG#AC0 is an embedded microprocessor IC from Renesas featuring ARM® Cortex®‑A55 and ARM® Cortex®‑M33 cores in a 3‑core, 64‑bit configuration. It supplies operating frequencies listed at 200 MHz and 1.2 GHz and integrates multimedia and graphics processing capabilities.
Designed for embedded systems requiring networking, display handling and industrial temperature operation, this device combines on‑chip graphics acceleration, multiple high‑speed interfaces and DDR memory controllers to support connected, display‑centric designs.
Key Features
- Core Architecture ARM® Cortex®‑A55 and ARM® Cortex®‑M33 cores; 3 cores total with 64‑bit support and operating frequencies noted at 200 MHz and 1.2 GHz.
- Graphics & Multimedia Includes ARM® Mali‑G31 and multimedia acceleration plus NEON™ SIMD for enhanced media processing and graphics acceleration.
- Memory Support Integrated controllers for DDR3L and DDR4 memory to support system memory requirements for application and multimedia workloads.
- Display Interfaces Supports LCD and MIPI interfaces including MIPI/CSI and MIPI/DSI for camera and display subsystem integration.
- Networking & I/O Dual Ethernet ports supporting 10/100/1000 Mbps and two USB 2.0 interfaces, plus CANbus for vehicle or industrial fieldbus connections.
- Package & Mounting Supplied in a 551‑LFBGA package (21×21) intended for surface‑mount PCB assembly.
- Industrial Qualification & Temperature Range Qualification level listed as Industrial with an operating temperature range of −40 °C to 85 °C.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Industrial Controllers Use the dual Gigabit Ethernet, CANbus and industrial temperature rating for networked control and monitoring equipment.
- Human‑Machine Interfaces (HMI) Combine display interfaces (LCD, MIPI/DSI) and graphics acceleration for operator panels and touch displays.
- Multimedia‑Enabled Embedded Systems Leverage the Mali‑G31 and NEON SIMD multimedia capabilities alongside DDR memory support for content‑rich embedded appliances.
Unique Advantages
- Mixed‑Core Flexibility: The combination of ARM® Cortex®‑A55 and Cortex®‑M33 cores provides multi‑tier processing options for application and real‑time tasks.
- Integrated Networking: Dual 10/100/1000 Mbps Ethernet ports and USB 2.0 interfaces enable high‑bandwidth connectivity for networked devices.
- Display and Camera Support: Native support for LCD plus MIPI/CSI and MIPI/DSI interfaces simplifies integration of displays and camera subsystems.
- Memory Compatibility: DDR3L and DDR4 controller support gives design flexibility for varying performance and cost targets.
- Industrial‑Grade Operation: Industrial qualification and an operating range of −40 °C to 85 °C support deployment in harsh environments.
- Compact SMT Package: 551‑LFBGA (21×21) surface‑mount packaging enables a compact board footprint for space‑constrained systems.
Why Choose R9A07G054L24GBG#AC0?
The R9A07G054L24GBG#AC0 positions itself as a capable embedded MPU that balances multi‑core processing, multimedia acceleration and extensive I/O in a single device. Its feature set—including ARM® Cortex® cores, Mali‑G31 graphics, DDR3L/DDR4 memory support and dual Gigabit Ethernet—addresses designs that require network connectivity, display capability and industrial robustness.
Manufactured by Renesas and supplied in a compact 551‑LFBGA package with industrial qualification and wide temperature range, this part is suitable for embedded system designers targeting reliable, connected and display‑enabled applications.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016