R9A07G054L18GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 1,007 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L18GBG#BC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G054L18GBG#BC0 is a Renesas RZ/V2L microprocessor IC featuring a dual-core 64-bit architecture. The device integrates ARM® Cortex®-A55 and ARM® Cortex®-M33 cores with operating points at 200 MHz and 1.2 GHz, targeting advanced edge and embedded applications.

Designed for industrial environments, this MPU combines multimedia acceleration, broad memory interface support, and high-speed connectivity to address use cases such as HMI, industrial networking, gateway devices, and edge processing where performance and integration matter.

Key Features

  • Dual-Core 64‑Bit Architecture Two-core 64-bit design integrating ARM® Cortex®-A55 and ARM® Cortex®-M33 with clock domains at 200 MHz and 1.2 GHz for balanced application and control processing.
  • Multimedia & Acceleration ARM® Mali‑G31 graphics acceleration plus NEON™ SIMD support for multimedia and signal processing workloads.
  • Memory Interfaces Built-in memory controller support for DDR3L and DDR4 DRAM to accommodate a range of system memory requirements.
  • Display & Camera Interfaces Integrated controllers for LCD and MIPI interfaces including MIPI/CSI and MIPI/DSI for HMI and vision applications.
  • High-Speed Networking Dual 10/100/1000 Mbps Ethernet ports for wired network connectivity and industrial networking use.
  • USB Connectivity USB 2.0 interfaces (2) for peripheral and host connectivity.
  • Automotive-Grade Peripheral CANbus interface for robust vehicle or industrial fieldbus communication.
  • Industrial Qualification & Temperature Range Qualified for industrial use with operating temperature from −40 °C to 85 °C.
  • Package & Mounting 551‑LFBGA (21 × 21 mm) package in a surface-mount form factor suitable for compact embedded designs.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial Control & Automation Use the dual-core MPU and deterministic Cortex‑M33 domain for control tasks while the Cortex‑A55 domain handles HMI and data processing.
  • Human‑Machine Interfaces (HMI) MIPI/DSI, LCD controllers and Mali‑G31 acceleration enable responsive, visually rich operator interfaces.
  • Edge Gateways & Networking Dual Gigabit Ethernet and USB support make the device suitable for wired gateway and industrial communication nodes.
  • Vision & Multimedia Edge Processing MIPI/CSI, NEON SIMD and Mali‑G31 provide the interfaces and acceleration for camera-based processing and multimedia tasks at the edge.

Unique Advantages

  • Balanced Dual‑Domain Processing: Separate Cortex® cores enable isolation of real-time control and application processing within a single device.
  • Integrated Multimedia Subsystem: Graphics acceleration and NEON SIMD reduce the need for external accelerators for GUI and media workloads.
  • Flexible Memory Support: DDR3L and DDR4 controller compatibility allows designers to choose memory tradeoffs between cost and performance.
  • Robust Connectivity Set: Gigabit Ethernet, USB 2.0, and CANbus provide a broad connectivity portfolio for industrial and edge system integration.
  • Industrial Temperature Qualification: Rated operation from −40 °C to 85 °C supports deployment in harsh or extended-temperature environments.
  • Compact Surface‑Mount Package: 551‑LFBGA (21×21) enables high integration density for space-constrained embedded systems.

Why Choose R9A07G054L18GBG#BC0?

The R9A07G054L18GBG#BC0 positions itself as a versatile MPU for edge and embedded systems that require a blend of application performance, control-domain determinism, and multimedia capability. With dual-core 64‑bit processing, graphics acceleration, and extensive I/O and memory interface support, it suits designs that combine human interfaces, network connectivity, and local data processing.

Backed by the RZ family ecosystem and development environment, this device offers a pathway for scalable designs that benefit from Renesas’ embedded processor tools and partner integrations, delivering long-term robustness and maintainability for industrial deployments.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for R9A07G054L18GBG#BC0.

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