R9A07G054L24GBG#BC0

The R9A07G054L24GBG#BC0 is a Renesas RZ/V2L series microprocessor IC combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit configuration. It provides integrated graphics and multimedia processing alongside broad memory and peripheral support for embedded and industrial applications.

Designed for embedded systems requiring mixed‑domain processing and display/multimedia interfaces, the device emphasizes integration of high‑speed networking, display controllers and memory interfaces while meeting industrial temperature requirements.

Key Features

• Core and Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3‑core, 64‑bit configuration with documented frequency points at 200 MHz and 1.2 GHz.
• Graphics and Multimedia  Integrated ARM® Mali‑G31 graphics acceleration and NEON™ SIMD multimedia support for accelerated visual and media processing.
• Memory Support  Built‑in memory controllers supporting DDR3L and DDR4 SDRAM for flexible system memory choices.
• Display and Camera Interfaces  Native display interface controllers including LCD plus MIPI CSI/DSI for camera and display subsystem integration.
• Networking and Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports and CANbus for deterministic field connectivity and high‑speed networking.
• Package and Mounting  551‑LFBGA package (21 × 21 mm), surface‑mount construction suited to compact board designs.
• Operating Range and Qualification  Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

• Industrial Embedded Systems  Multi‑core processing, dual Gigabit Ethernet and CANbus support make the device suitable for industrial control and automation platforms.
• Display and HMI  Integrated Mali‑G31 graphics and LCD/MIPI display interfaces enable advanced human‑machine interfaces and operator panels.
• Imaging and Vision  MIPI CSI support combined with NEON™ SIMD and multimedia acceleration for embedded vision and camera processing tasks.

Unique Advantages

• Multi‑domain Processing:  Combines ARM® Cortex®-A55 and Cortex®-M33 cores in a single 3‑core package to handle application and real‑time tasks concurrently.
• Integrated Graphics Acceleration:  Mali‑G31 acceleration and NEON™ SIMD enable offloading of visual and media workloads from general‑purpose cores.
• Comprehensive I/O Suite:  Dual Gigabit Ethernet, USB 2.0, CANbus and multiple display/camera interfaces provide broad connectivity without external bridges.
• Flexible Memory Options:  Support for DDR3L and DDR4 memory controllers accommodates a range of performance and cost targets.
• Industrial‑Ready Thermal Range:  Rated for −40 °C to 85 °C operation and industrial qualification for deployment in demanding environments.
• Compact BGA Packaging:  551‑LFBGA (21 × 21 mm) package balances high integration with space‑efficient board layouts.

Why Choose R9A07G054L24GBG#BC0?

The R9A07G054L24GBG#BC0 positions itself as an integrated microprocessor solution for embedded and industrial applications that require a mix of application processing, real‑time control and multimedia/display capabilities. Its combination of ARM® Cortex® cores, graphics acceleration, extensive peripheral set and memory flexibility supports compact, feature‑rich system designs.

This part is suited to developers and OEMs building industrial controllers, HMIs, embedded vision systems and other connected embedded products that benefit from multi‑core processing, robust connectivity and an industrial operating temperature range.

Request a quote or submit an inquiry to obtain pricing, availability and support options for R9A07G054L24GBG#BC0. Our team can provide the details you need to evaluate this device for your design.