R9A07G054L28GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 3 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21) |
|---|---|
| Quantity | 1,577 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G054 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Mali-G31, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 551-LFBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, MIPI/CSI, MIPI/DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 551-LFBGA | RAM Controllers | DDR3L, DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz, 1.2GHz | ||
| Supplier Device Package | 551-LFBGA (21×21) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G054L28GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA
The R9A07G054L28GBG#AC0 is a 3-core microprocessor IC from Renesas' R9A07G054 series featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. It combines 64-bit processing with dedicated multimedia acceleration and a broad set of peripheral interfaces.
Designed for embedded and industrial applications, this MPU delivers integrated connectivity, display and memory controller support in a 551-LFBGA (21×21) surface-mount package, and is qualified for industrial temperature ranges.
Key Features
- Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration offering both application and real-time processing capabilities.
- Performance Multi-frequency operation documented at 200 MHz and 1.2 GHz to address mixed workloads across application and control domains.
- Graphics & Multimedia Integrated graphics acceleration with ARM® Mali‑G31 and NEON™ SIMD for multimedia processing and accelerated compute tasks.
- Memory Interfaces Supports DDR3L and DDR4 memory controllers for flexible high-bandwidth system memory options.
- Display & Camera Display interface controllers include LCD, MIPI/CSI and MIPI/DSI to support a range of displays and camera modules.
- Connectivity Dual Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports and CANbus provide extensive wired connectivity for networked embedded systems.
- Package & Mounting 551-LFBGA (21×21) surface-mount package suitable for compact board designs.
- Industrial Qualification & Temperature Qualified for industrial applications with an operating temperature range of −40 °C to 85 °C and RoHS compliance.
Typical Applications
- Industrial Control Industrial systems requiring robust operation and deterministic control can leverage the M33 core alongside multiple connectivity options including CANbus and dual Gigabit Ethernet.
- Embedded HMI and Displays Integrated display controllers (LCD, MIPI/DSI) and graphics acceleration enable advanced human-machine interfaces and graphical displays.
- Edge Multimedia & Vision MIPI/CSI support combined with Mali‑G31 and NEON™ SIMD provides capabilities for camera input and multimedia processing at the edge.
- Networked Embedded Devices Dual Gigabit Ethernet and USB 2.0 interfaces make the device suitable for connected appliances, gateways, and industrial networking nodes.
Unique Advantages
- Heterogeneous Processing: Combines Cortex‑A55 and Cortex‑M33 cores to separate application-level and real-time control tasks within a single device.
- Integrated Multimedia Engine: Mali‑G31 graphics and NEON™ SIMD accelerate visual and media workloads without offloading to external processors.
- Broad Interface Set: Built-in Ethernet, USB, CANbus and multiple display/camera interfaces reduce external PHY and bridge requirements.
- Flexible Memory Support: DDR3L and DDR4 controller compatibility simplifies integration with common system memory choices.
- Industrial-Ready: Industrial qualification and a −40 °C to 85 °C operating range support deployment in demanding environments.
- Compact Packaging: 551-LFBGA (21×21) package enables dense board layouts for space-constrained designs.
Why Choose R9A07G054L28GBG#AC0?
The R9A07G054L28GBG#AC0 positions itself as a compact, integrated solution for embedded and industrial designs that need a mix of application performance, real-time control, multimedia acceleration and extensive I/O. Its combination of ARM® Cortex® cores, graphics acceleration and multiple high-speed interfaces makes it well suited for developers building display-rich, networked or camera-enabled systems.
Backed by Renesas and delivered in an industrial-qualified package, this MPU provides a clear path for designs that require reliable operation across temperature extremes, flexible memory options, and a dense feature set to reduce overall system complexity.
Request a quote or submit an inquiry with your project details and quantity requirements to receive pricing and availability information for R9A07G054L28GBG#AC0.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016