R9A07G054L28GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 3 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 1,577 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L28GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G054L28GBG#AC0 is a 3-core microprocessor IC from Renesas' R9A07G054 series featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores. It combines 64-bit processing with dedicated multimedia acceleration and a broad set of peripheral interfaces.

Designed for embedded and industrial applications, this MPU delivers integrated connectivity, display and memory controller support in a 551-LFBGA (21×21) surface-mount package, and is qualified for industrial temperature ranges.

Key Features

  • Core Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 3-core, 64-bit configuration offering both application and real-time processing capabilities.
  • Performance  Multi-frequency operation documented at 200 MHz and 1.2 GHz to address mixed workloads across application and control domains.
  • Graphics & Multimedia  Integrated graphics acceleration with ARM® Mali‑G31 and NEON™ SIMD for multimedia processing and accelerated compute tasks.
  • Memory Interfaces  Supports DDR3L and DDR4 memory controllers for flexible high-bandwidth system memory options.
  • Display & Camera  Display interface controllers include LCD, MIPI/CSI and MIPI/DSI to support a range of displays and camera modules.
  • Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps), two USB 2.0 ports and CANbus provide extensive wired connectivity for networked embedded systems.
  • Package & Mounting  551-LFBGA (21×21) surface-mount package suitable for compact board designs.
  • Industrial Qualification & Temperature  Qualified for industrial applications with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Industrial Control  Industrial systems requiring robust operation and deterministic control can leverage the M33 core alongside multiple connectivity options including CANbus and dual Gigabit Ethernet.
  • Embedded HMI and Displays  Integrated display controllers (LCD, MIPI/DSI) and graphics acceleration enable advanced human-machine interfaces and graphical displays.
  • Edge Multimedia & Vision  MIPI/CSI support combined with Mali‑G31 and NEON™ SIMD provides capabilities for camera input and multimedia processing at the edge.
  • Networked Embedded Devices  Dual Gigabit Ethernet and USB 2.0 interfaces make the device suitable for connected appliances, gateways, and industrial networking nodes.

Unique Advantages

  • Heterogeneous Processing: Combines Cortex‑A55 and Cortex‑M33 cores to separate application-level and real-time control tasks within a single device.
  • Integrated Multimedia Engine: Mali‑G31 graphics and NEON™ SIMD accelerate visual and media workloads without offloading to external processors.
  • Broad Interface Set: Built-in Ethernet, USB, CANbus and multiple display/camera interfaces reduce external PHY and bridge requirements.
  • Flexible Memory Support: DDR3L and DDR4 controller compatibility simplifies integration with common system memory choices.
  • Industrial-Ready: Industrial qualification and a −40 °C to 85 °C operating range support deployment in demanding environments.
  • Compact Packaging: 551-LFBGA (21×21) package enables dense board layouts for space-constrained designs.

Why Choose R9A07G054L28GBG#AC0?

The R9A07G054L28GBG#AC0 positions itself as a compact, integrated solution for embedded and industrial designs that need a mix of application performance, real-time control, multimedia acceleration and extensive I/O. Its combination of ARM® Cortex® cores, graphics acceleration and multiple high-speed interfaces makes it well suited for developers building display-rich, networked or camera-enabled systems.

Backed by Renesas and delivered in an industrial-qualified package, this MPU provides a clear path for designs that require reliable operation across temperature extremes, flexible memory options, and a dense feature set to reduce overall system complexity.

Request a quote or submit an inquiry with your project details and quantity requirements to receive pricing and availability information for R9A07G054L28GBG#AC0.

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