R9A07G054L17GBG#BC0

The R9A07G054L17GBG#BC0 is a Renesas RZ/V2L microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2-core, 64-bit configuration. The device lists operating frequencies of 200 MHz and 1.2 GHz and integrates multimedia and graphics acceleration alongside a broad set of peripheral interfaces.

Designed for embedded and edge applications, this industrial-qualified MPU targets advanced HMI, image processing and real-time networked control where performance, interface integration and industrial temperature operation are required.

Key Features

• CPU Cores — Dual-core architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 64-bit, 2-core configuration for mixed application and control workloads.
• Operating Frequencies — Device description lists operating points of 200 MHz and 1.2 GHz to support both real-time control and higher-performance processing.
• Multimedia & DSP — ARM® Mali-G31 graphics acceleration and NEON™ SIMD for multimedia and signal processing tasks.
• Memory Interfaces — Integrated controllers for DDR3L and DDR4 memories to support system memory needs.
• Display & Camera — Display interface controllers including LCD, MIPI/CSI and MIPI/DSI for HMI and image-input applications.
• High-speed Networking — Dual Gigabit Ethernet (10/100/1000 Mbps) for industrial networking and high-throughput data transfer.
• USB & Fieldbus — Two USB 2.0 ports and CANbus interface support peripheral connectivity and automotive-style fieldbus integration.
• Package & Mounting — 456-LFBGA package (15 × 15 mm), surface-mount, optimized for compact board designs.
• Industrial Qualification & Temperature — Industrial qualification with operating temperature range of -40 °C to 85 °C for deployment in harsh environments.
• Compliance — RoHS compliant to meet environmental requirements.

Typical Applications

• Industrial Automation — Embedded control and HMI systems that require industrial temperature operation, Ethernet connectivity and real-time control capabilities.
• Human‑Machine Interfaces (HMI) — High-resolution displays and multimedia interfaces using MIPI/DSI and LCD controllers combined with graphics acceleration for responsive UIs.
• Vision and Image Processing — Camera input via MIPI/CSI and NEON™ SIMD acceleration for on‑edge image analysis and multimedia processing.
• Robotics and Autonomous Devices — Networked control and sensor fusion using CANbus, Gigabit Ethernet and mixed-core processing for coordination between control and application tasks.
• Infrastructure & Building Management — Networked edge devices that require robust connectivity, display capability and industrial temperature operation.

Unique Advantages

• Flexible compute topology: Dual ARM cores (Cortex‑A55 and Cortex‑M33) allow separation of application-level processing and deterministic control tasks.
• Integrated multimedia and graphics: Mali‑G31 and NEON™ SIMD reduce external accelerator requirements for image and UI workloads.
• Broad interface set: DDR3L/DDR4 memory support, MIPI/CSI, MIPI/DSI, dual Gigabit Ethernet, USB 2.0 and CANbus simplify system design and reduce BOM complexity.
• Industrial-grade readiness: Industrial qualification and -40 °C to 85 °C operation support deployment in factory, infrastructure and building environments.
• Compact, standardized package: 456‑LFBGA (15 × 15 mm) surface-mount package enables high-density board layouts without sacrificing I/O capability.
• Environmentally compliant: RoHS compliance supports regulatory and corporate environmental requirements.

Why Choose R9A07G054L17GBG#BC0?

The R9A07G054L17GBG#BC0 positions itself as an integrated MPU solution for edge and embedded systems that require a combination of application processing and deterministic control. With ARM® Cortex® cores, graphics acceleration, extensive display and network interfaces, and industrial temperature qualification, it addresses designs demanding both performance and system integration.

This part is suited for engineers building industrial HMI, vision-enabled controllers, robotics platforms and infrastructure-edge devices that benefit from consolidated peripherals, standardized memory support and a compact 456‑LFBGA package. Its inclusion in the Renesas RZ family also aligns with available development environments and ecosystem resources for scalable product development.

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