R9A07G054L13GBG#BC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 349 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L13GBG#BC0 – IC MPU RZ 200MHz/1.2GHz 456BGA

The R9A07G054L13GBG#BC0 is a Renesas RZ/V2L microprocessing unit combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 2-core, 64‑bit configuration. The device lists operating frequencies of 200 MHz and 1.2 GHz and integrates multimedia and networking capabilities for embedded edge applications.

Designed for industrial environments, this MPU targets edge devices requiring mixed high-performance application processing and real-time control, with on‑die graphics/multimedia acceleration, multi‑port Ethernet, and a broad set of display and I/O interfaces.

Key Features

  • Core & Performance 
    Dual-core architecture featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 with listed operating speeds of 200 MHz and 1.2 GHz supporting 64‑bit processing.
  • Graphics & Multimedia 
    Includes ARM® Mali-G31 graphics and NEON™ SIMD for multimedia acceleration and enhanced compute for image and video tasks.
  • Memory & Display 
    Supports DDR3L and DDR4 memory controllers and display interfaces including LCD, MIPI/CSI and MIPI/DSI for high‑quality HMI and camera integration.
  • Connectivity 
    Two 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports and CANbus support provide a wide range of wired communication options for industrial networking and device connectivity.
  • System Integration 
    Integrated multimedia and networking peripherals reduce external BOM and simplify system design for edge applications requiring both UI and real‑time control.
  • Package & Mounting 
    456‑LFBGA (15 × 15 mm) surface‑mount package suitable for compact embedded board designs.
  • Operating Range & Qualification 
    Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance for deployment in industrial environments.

Typical Applications

  • Industrial Edge Controllers 
    Use the device for real‑time control and networked monitoring where Ethernet and CANbus connectivity are required.
  • Human‑Machine Interfaces (HMI) 
    Drive high‑quality displays and camera input using MIPI/DSI and MIPI/CSI with onboard graphics acceleration for responsive UIs.
  • Embedded Vision & Multimedia 
    Leverage Mali‑G31 and NEON SIMD for image/video processing and multimedia tasks at the edge.
  • Networked Appliances & Gateways 
    Dual gigabit Ethernet and USB enable robust wired connectivity for gateways, industrial appliances, and edge servers.

Unique Advantages

  • Balanced heterogeneous cores 
    Combines ARM® Cortex®-A55 and Cortex®-M33 cores to separate application and real‑time tasks within a single device.
  • Integrated multimedia stack 
    Mali‑G31 and NEON SIMD offer on‑chip acceleration that reduces the need for external video or graphics processors.
  • Broad memory and display support 
    DDR3L/DDR4 compatibility and multiple display interfaces simplify integration across a range of HMI and camera configurations.
  • Industrial connectivity 
    Dual gigabit Ethernet, USB 2.0 and CANbus support enable reliable networking and field communication for industrial systems.
  • Industrial temperature and package 
    Operation from −40 °C to 85 °C and a 456‑LFBGA surface‑mount package support robust deployment in constrained embedded designs.
  • RoHS compliant 
    Environmental compliance helps meet regulatory and manufacturing requirements for commercial and industrial products.

Why Choose R9A07G054L13GBG#BC0?

The R9A07G054L13GBG#BC0 positions itself as a tightly integrated MPU for edge devices that require a blend of application processing, real‑time control, multimedia acceleration, and industrial networking. Its combination of ARM® Cortex® cores, graphics acceleration, and multiple I/O interfaces makes it suitable for compact systems that need both performance and predictable operation across industrial temperature ranges.

For designers seeking a scalable platform with a broad ecosystem and development environment options documented in the RZ family materials, this part provides the connectivity, display and memory interfaces commonly required by industrial HMIs, embedded vision systems, and networked controllers.

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