R9A07G054L17GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 456BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)

Quantity 260 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package456-LFBGA (15x15)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case456-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package456-LFBGA (15×15)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L17GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 456BGA

The R9A07G054L17GBG#AC0 is a Renesas RZ/V2L microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a dual-core, 64-bit configuration. It targets embedded and industrial applications that require integrated graphics, multimedia acceleration, and high-speed interfaces in a compact 456-LFBGA (15×15) surface-mount package.

With integrated DDR3L/DDR4 memory controllers, dual Gigabit Ethernet, multiple USB and display interfaces, and industrial-grade temperature qualification, this MPU delivers a balance of performance, connectivity, and environmental robustness for industrial and embedded designs.

Key Features

  • Processor Cores  ARM® Cortex®-A55 and ARM® Cortex®-M33 dual-core, 64-bit architecture for a combination of application processing and real-time control.
  • Operating Frequencies  Device description lists operating frequencies of 200 MHz and 1.2 GHz.
  • Graphics & Multimedia  Integrated ARM® Mali-G31 GPU and NEON™ SIMD provide graphics acceleration and multimedia processing capabilities.
  • Memory Interfaces  On-chip controllers support DDR3L and DDR4 memory types for flexible memory subsystem design.
  • Display and Camera Interfaces  Built-in controllers for LCD plus MIPI CSI and MIPI DSI enable display and camera subsystem integration.
  • Ethernet & USB  Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports provide high-speed wired networking and peripheral connectivity.
  • Automotive-Style Fieldbus  CANbus interface available for robust node-to-node communications in industrial networks.
  • Package & Mounting  456-LFBGA (15×15) supplier device package designed for surface-mount PCB assembly.
  • Industrial Qualification & Temperature Range  Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Industrial Control Systems  Dual-core processing with CANbus and dual Gigabit Ethernet supports deterministic control, communications, and HMI tasks in industrial equipment.
  • Embedded Multimedia Devices  Mali-G31 GPU, NEON SIMD, and MIPI display/camera interfaces enable rich user interfaces and multimedia playback in embedded products.
  • Edge Networking Appliances  Dual Gigabit Ethernet and USB 2.0 ports provide connectivity for edge routers, gateways, and protocol converters in industrial networks.
  • Human‑Machine Interfaces (HMIs)  Integrated display controllers and graphics acceleration support responsive, high-resolution operator panels and touchscreen interfaces.

Unique Advantages

  • Integrated Dual-Core Architecture: Combines ARM® Cortex®-A55 and Cortex®-M33 cores to separate application processing and real-time control functions on a single device.
  • Broad I/O and Interface Support: Built-in DDR3L/DDR4 controllers, MIPI display/camera, dual Gigabit Ethernet, USB, and CANbus reduce external component count and simplify board design.
  • On-Device Graphics Acceleration: ARM® Mali-G31 and NEON™ SIMD accelerate GUI and multimedia tasks without requiring an external GPU.
  • Industrial-Grade Operation: Qualified for industrial use with an operating range of −40 °C to 85 °C for deployments in demanding environments.
  • Compact, Surface-Mount Package: 456-LFBGA (15×15) package provides high functional density for space-constrained embedded systems.

Why Choose R9A07G054L17GBG#AC0?

The R9A07G054L17GBG#AC0 positions itself as a highly integrated embedded MPU for industrial and embedded designs that require combined application and control processing, multimedia capabilities, and extensive connectivity. Its dual-core ARM® architecture, integrated GPU, and wide interface set support consolidated system designs that reduce BOM complexity.

Designed and manufactured by Renesas as part of the R9A07G054 series, this device is suited to engineers and product teams building industrial HMIs, edge networking appliances, and embedded multimedia systems that demand industrial temperature operation and compact package form factors.

Request a quote or contact sales to discuss availability, lead times, and pricing for R9A07G054L17GBG#AC0.

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