R9A07G054L14GBG#AC0

IC MPU RZ 200MHZ/1.2GHZ 551BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/V2L 2 Core, 64-Bit 200MHz, 1.2GHz 551-LFBGA (21x21)

Quantity 1,989 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G054
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Mali-G31, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package551-LFBGA (21x21)
Display & Interface ControllersLCD, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case551-LFBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz, 1.2GHz
Supplier Device Package551-LFBGA (21×21)USBUSB 2.0 (2)Voltage – I/O1.8V, 3.3V

Overview of R9A07G054L14GBG#AC0 – IC MPU RZ 200MHZ/1.2GHZ 551BGA

The R9A07G054L14GBG#AC0 is a Renesas RZ/V2L microprocessor IC featuring an ARM® Cortex®-A55 and an ARM® Cortex®-M33 in a 2-core, 64-bit configuration with operating points at 200 MHz and 1.2 GHz. Designed for edge devices, it targets applications requiring combined application processing and real-time control with integrated multimedia and connectivity interfaces.

Built into a 551-LFBGA (21×21) surface-mount package and qualified for industrial use, this MPU delivers a balance of compute, graphics acceleration, and peripheral integration suitable for HMI, industrial networking, vision, and embedded control systems.

Key Features

  • Core & Performance  Dual-core, 64-bit architecture with ARM® Cortex®-A55 and ARM® Cortex®-M33 processors and operating frequencies at 200 MHz and 1.2 GHz for partitioned application and control workloads.
  • Graphics & Multimedia  Integrated ARM® Mali-G31 and NEON™ SIMD for multimedia processing and graphics acceleration.
  • Memory Support  On-chip controllers supporting DDR3L and DDR4 memory interfaces to meet varying system memory performance and capacity needs.
  • Display & Vision Interfaces  Display interface controllers including LCD and MIPI (CSI/DSI) support for high-quality HMI and camera connectivity.
  • Network & Connectivity  Dual 10/100/1000 Mbps Ethernet ports, two USB 2.0 ports, and CANbus support for robust wired networking and in-vehicle/industrial communications.
  • Package & Mounting  551-LFBGA (21×21) surface-mount package suitable for compact embedded designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Edge AI & Vision  On-device image analysis and multimedia processing using integrated Mali-G31 and NEON for accelerated vision workloads.
  • Human-Machine Interface (HMI)  High-resolution displays and responsive UI control via LCD and MIPI/DSI display interfaces.
  • Industrial Networking & Control  Dual gigabit Ethernet, CANbus, and deterministic control capability for industrial automation and networked control systems.
  • Robotics & Automation  Combined application and real-time control processing for autonomous functions, sensor fusion, and motion control tasks.
  • Embedded Appliances & Infrastructure  Edge processing for building management, power systems, and connected appliances requiring multimedia and communication interfaces.

Unique Advantages

  • Heterogeneous dual-core architecture: Enables separation of high-level application processing and real-time control, simplifying software partitioning and system design.
  • Integrated multimedia and graphics acceleration: Mali-G31 plus NEON SIMD provide hardware acceleration for video, imaging, and rich UIs without external GPUs.
  • Comprehensive connectivity: Dual gigabit Ethernet, USB 2.0, and CANbus reduce the need for external bridge components and streamline board-level integration.
  • Flexible memory interface: Support for DDR3L and DDR4 allows designers to choose memory technology that matches performance and cost targets.
  • Industrial-grade robustness: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh or temperature-variable environments.
  • Compact package: 551-LFBGA (21×21) package offers a high-density footprint for space-constrained embedded systems.

Why Choose R9A07G054L14GBG#AC0?

The R9A07G054L14GBG#AC0 positions itself as a balanced embedded MPU that combines application-class compute, dedicated control processing, multimedia acceleration, and broad I/O integration in an industrial-qualified package. It is suitable for designers building edge devices that need both responsive UI/vision capabilities and reliable real-time control.

As part of the Renesas RZ family, this device benefits from the family’s development environment and ecosystem support for Linux and RTOS workflows, helping reduce development time and easing system integration for long-term, scalable deployments.

Request a quote or submit an inquiry for pricing, lead times, and ordering information for R9A07G054L14GBG#AC0.

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