 | N/A | R9A07G054L23GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 456LFBGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 433 | |
| N/A | | R9A07G054L23GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 1,385 | |
 | N/A | R9A07G054L24GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 551LFBGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,918 | |
| N/A | | R9A07G054L24GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 1,191 | |
| N/A | | R9A07G054L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 294 | |
| N/A | | R9A07G054L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) | 668 | |
| N/A | | R9A07G054L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 846 | |
| N/A | | R9A07G054L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) | 938 | |
 | | R9A07G063U01GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) | 363 | |
 | | R9A07G063U01GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) | 875 | |
 | | R9A07G063U02GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) | 702 | |
 | | R9A07G063U02GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) | 772 | |
| N/A | | R9A07G074M01GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT N | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 1,565 | |
 | | R9A07G074M04GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT NON-S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 752 | |
| N/A | | R9A07G074M05GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 570 | |
| N/A | | R9A07G074M08GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT SEC | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) | 491 | |
| N/A | | R9A07G075M01GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) | 674 | |
| N/A | | R9A07G075M01GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) | 844 | |
| N/A | | R9A07G075M05GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) | 59 | |
| N/A | | R9A07G075M05GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) | 249 | |