| N/A | | S32K328GHT1MJBSR | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 618 | |
| N/A | | S32K328GHT1MJBST | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 1,566 | |
| N/A | | S32K328GHT1MPCSR | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 1,431 | |
| N/A | | S32K328GHT1MPCST | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 1,549 | |
| N/A | | S32K328GHT1VJBSR | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 295 | |
| N/A | | S32K328GHT1VJBST | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 1,450 | |
| N/A | | S32K328GHT1VPCSR | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 10 | |
| N/A | | S32K328GHT1VPCST | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 833 | |
| N/A | | S32K328NHT1VPCSR | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 279 | |
| N/A | | S32K328NHT1VPCST | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 1,630 | |
| N/A | | S32K338GHT1MJBSR | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 1,118 | |
| N/A | | S32K338GHT1MJBST | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 610 | |
| N/A | | S32K338GHT1MPCSR | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 633 | |
| N/A | | S32K338GHT1MPCST | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 274 | |
| N/A | | S32K338GHT1VJBSR | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 1,421 | |
| N/A | | S32K338GHT1VJBST | NXP Semiconductors | IC | Microcontrollers | 289-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14×14) | 62 | |
| N/A | | S32K338GHT1VPCSR | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 960 | |
| N/A | | S32K338GHT1VPCST | NXP Semiconductors | IC | Microcontrollers | 172-QFP-EP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP-EP Package / Case: 172-QFP Exposed Pad | 747 | |
 | | S32K341EHT0MPAST | NXP Semiconductors | S32K341, 1MB FLASH, LOCKSTEP COR | Microcontrollers | 100-MaxQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MaxQFP (10×10) | 305 | |
| N/A | | S32K341EHT0MPBST | NXP Semiconductors | IC MCU 32BIT2 1MB FLASH 172QFP | Microcontrollers | 172-QFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, I2C, LINbuS, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 172-QFP (16×16) | 62 | |