| N/A | | R9A07G075M22GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 1,358 | |
| N/A | | R9A07G075M22GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 508 | |
| N/A | | R9A07G075M24GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 1,239 | |
 | | R9A07G075M24GBG#AC0 | Renesas | IC MPU 600MHZ/800MHZ 320LFBGA | Microprocessors | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) | 774 | |
| N/A | | R9A07G075M26GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 1,489 | |
| N/A | | R9A07G075M26GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 39 | |
| N/A | | R9A07G075M27GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 644 | |
| N/A | | R9A07G075M28GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 444 | |
| N/A | | R9A07G075M28GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) | 325 | |
| N/A | | R9A07G084M04GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (10×10) | 1,336 | |
 | | R9A07G084M04GBG#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) | 479 | |
| N/A | | R9A07G084M08GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (10×10) | 157 | |
| N/A | | R9A07G084M08GBG#AC0 | Renesas | IC MPU RZ 300/400MHZ 225LFBGA | Microprocessors | 225-LFBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-LFBGA (13×13) | 107 | |
 | | R9A08G045S11GBG#AC0 | Renesas | SOC RZ/G3S 13BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 7 | |
 | | R9A08G045S11GBG#BC0 | Renesas | SOC RZ/G3S 13BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 555 | |
 | | R9A08G045S13GBG#AC0 | Renesas | SOC RZ/G3S 14BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 501 | |
 | | R9A08G045S13GBG#BC0 | Renesas | SOC RZ/G3S 14BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 410 | |
 | | R9A08G045S15GBG#AC0 | Renesas | SOC RZ/G3S 13BGA SECURE(BULK) | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 166 | |
 | | R9A08G045S15GBG#BC0 | Renesas | SOC RZ/G3S 13BGA SECURE(FULL) | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 1,712 | |
 | | R9A08G045S17GBG#AC0 | Renesas | SOC RZ/G3S 14BGA SECURE 1+1CPU(B | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) | 674 | |