Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AR9A07G075M22GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,358
N/AR9A07G075M22GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
508
N/AR9A07G075M24GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,239
R9A07G075M24GBG#AC0R9A07G075M24GBG#AC0RenesasIC MPU 600MHZ/800MHZ 320LFBGAMicroprocessors320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (17×17)
774
N/AR9A07G075M26GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
1,489
N/AR9A07G075M26GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
39
N/AR9A07G075M27GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
644
N/AR9A07G075M28GBA#AC0RenesasIC MPU RZ/T2M 600/800MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
444
N/AR9A07G075M28GBG#AC0RenesasIC MPU RZ/T2M 600/800MHZ 320FBGAMicroprocessors320-FBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-FBGA (17×17)
325
N/AR9A07G084M04GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
1,336
R9A07G084M04GBG#AC0R9A07G084M04GBG#AC0RenesasIC MPU RZ/N2L 300/400MHZ 225FBGAMicroprocessors225-FBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-FBGA (13×13)
479
N/AR9A07G084M08GBA#AC0RenesasIC MPU RZ/N2L 300/400MHZ 121FBGAMicroprocessors121-FBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
121-LFBGA
Supplier Device Package:
121-FBGA (10×10)
157
N/AR9A07G084M08GBG#AC0RenesasIC MPU RZ 300/400MHZ 225LFBGAMicroprocessors225-LFBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
Mounting Type:
Surface Mount
Package / Case:
225-LFBGA
Supplier Device Package:
225-LFBGA (13×13)
107
R9A08G045S11GBG#AC0R9A08G045S11GBG#AC0RenesasSOC RZ/G3S 13BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
7
R9A08G045S11GBG#BC0R9A08G045S11GBG#BC0RenesasSOC RZ/G3S 13BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
555
R9A08G045S13GBG#AC0R9A08G045S13GBG#AC0RenesasSOC RZ/G3S 14BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
501
R9A08G045S13GBG#BC0R9A08G045S13GBG#BC0RenesasSOC RZ/G3S 14BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
410
R9A08G045S15GBG#AC0R9A08G045S15GBG#AC0RenesasSOC RZ/G3S 13BGA SECURE(BULK)Microprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
166
R9A08G045S15GBG#BC0R9A08G045S15GBG#BC0RenesasSOC RZ/G3S 13BGA SECURE(FULL)Microprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
1,712
R9A08G045S17GBG#AC0R9A08G045S17GBG#AC0RenesasSOC RZ/G3S 14BGA SECURE 1+1CPU(BMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
674

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up