R9A08G045S13GBG#BC0

The R9A08G045S13GBG#BC0 is a Renesas RZ/G3S series system-on-chip featuring an ARM® Cortex®-A55 64-bit core running at 1.1 GHz with an ARM® Cortex®-M33 co-processor. Designed for embedded and industrial applications, the device integrates memory controllers, dual Gigabit Ethernet, USB 2.0 OTG, hardware security functions and DMA in a compact 361-LFBGA (13×13) surface-mount package.

Qualified for industrial use and RoHS compliant, the part supports an operating temperature range of −40 °C to 85 °C, making it suitable for networked and secure embedded systems that require rugged operation and integrated connectivity.

Key Features

• Processing ARM® Cortex®-A55 64-bit main core at 1.1 GHz paired with an ARM® Cortex®-M33 co-processor for separating application and control tasks.
• Memory Integrated DDR4 and LPDDR4 memory controllers to support modern DRAM interfaces.
• Networking Two 10/100/1000 Mbps Ethernet ports for wired network connectivity.
• USB Two USB 2.0 OTG interfaces for host/device connectivity and peripheral support.
• Security Hardware security functions including AES, ARM TZ, Hash, RSA, Secure Boot and TRNG.
• System I/O DMA support to optimize data movement and reduce CPU overhead.
• Package & Mounting 361-LFBGA (13×13) surface-mount package for compact PCB designs.
• Qualification & Environment Industrial qualification and RoHS compliant with an operating temperature range of −40 °C to 85 °C.

Typical Applications

• Industrial control and automation Dual Gigabit Ethernet and industrial temperature rating support networked controllers and automation nodes.
• Secure embedded appliances On-chip AES, RSA, Secure Boot and TRNG enable authenticated boot and cryptographic functions for secure devices.
• Networked communication equipment Two Ethernet ports and USB OTG interfaces facilitate wired connectivity and peripheral interfacing for gateways and communication modules.

Unique Advantages

• Balanced compute and control: Cortex-A55 main core with a Cortex-M33 co-processor enables separation of application and control tasks.
• Integrated connectivity: Dual Gigabit Ethernet and two USB 2.0 OTG ports reduce external interface components.
• Comprehensive on-chip security: AES, ARM TZ, Hash, RSA, Secure Boot and TRNG simplify implementation of secure boot and cryptographic features.
• Industrial-ready operation: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
• Flexible memory options: DDR4 and LPDDR4 controllers accommodate varied performance and power requirements.
• Space-efficient package: 361-LFBGA (13×13) surface-mount package supports dense board layouts.

Why Choose R9A08G045S13GBG#BC0?

The R9A08G045S13GBG#BC0 delivers a compact, industrial-grade SoC solution that combines a 1.1 GHz Cortex-A55 application core with an ARM Cortex-M33 co-processor, integrated memory controllers, dual Gigabit Ethernet, USB OTG and a suite of hardware security features. Its integration reduces external component count while supporting industrial temperature requirements.

Manufactured by Renesas and RoHS compliant, this device is suited to embedded and industrial customers seeking a secure, networked processing node with a compact package and a range of built-in connectivity and security functions.

Request a quote or submit an inquiry for R9A08G045S13GBG#BC0 to evaluate its fit for your next embedded or industrial project.