R9A08G045S13GBG#AC0

SOC RZ/G3S 14BGA NON-SECURE 1+1C
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 349 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.1GHzSupplier Device Package361-LFBGA (13×13)
USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S13GBG#AC0 – SOC RZ/G3S 14BGA NON-SECURE 1+1C

The R9A08G045S13GBG#AC0 is a system-on-chip microprocessor from Renesas featuring an ARM® Cortex®-A55 main core running at 1.1 GHz. It integrates a Cortex®-M33 co-processor and on-chip controllers designed for embedded and industrial applications where performance, connectivity and hardware security features are required.

Targeted at industrial and embedded markets, this device provides a compact 361-LFBGA (13×13) surface-mount package, industrial temperature qualification and a set of integrated interfaces for networking and peripheral connectivity.

Key Features

  • CPU Core  ARM® Cortex®-A55 single 64-bit core at 1.1 GHz, suitable for general-purpose application processing within embedded systems.
  • Co-processor  ARM® Cortex®-M33 co-processor for real-time control and offload of lower-level tasks.
  • Memory Controllers  Integrated support for DDR4 and LPDDR4 memories to connect modern external DRAM for system memory.
  • High-speed Ethernet  Dual 10/100/1000 Mbps Ethernet interfaces for robust wired networking and industrial communications.
  • USB Connectivity  Two USB 2.0 OTG ports for flexible peripheral and host connections.
  • Security Features  Hardware security suite including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG to support device integrity and secure operations.
  • Package & Mounting  361-LFBGA (13×13) supplier device package designed for surface-mount assembly in space-constrained boards.
  • Industrial Qualification & Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
  • System Interfaces  Built-in DMA and peripheral interfaces to streamline data movement and peripheral integration.

Typical Applications

  • Industrial Embedded Systems  Control and monitoring systems that require industrial temperature qualification and reliable wired networking.
  • Edge Networking & Gateways  Networked devices and gateways leveraging dual Gigabit Ethernet and USB OTG for flexible connectivity.
  • Secure IoT Endpoints  Devices requiring hardware security features such as AES, Secure Boot, RSA and TRNG to protect device integrity and communications.
  • Embedded Control & Sensor Hubs  Applications that can offload real-time tasks to the Cortex-M33 co-processor while the Cortex-A55 handles higher-level processing.

Unique Advantages

  • Balanced processing architecture: Combines a 64-bit Cortex-A55 application core with a Cortex-M33 co-processor to separate application and real-time workloads.
  • Integrated connectivity: Dual Gigabit Ethernet and two USB 2.0 OTG ports provide versatile wired networking and peripheral options without external controllers.
  • Comprehensive hardware security: On-chip AES, ARM TrustZone, hashing, RSA, Secure Boot and TRNG support secure device identity and trusted boot chains.
  • Industrial-ready thermal range: Rated for −40 °C to 85 °C operation to meet environmental requirements of industrial deployments.
  • Modern memory support: DDR4 and LPDDR4 memory controller support enables use of current DRAM technologies for performance and capacity.
  • Compact BGA packaging: 361-LFBGA (13×13) package provides a small footprint for dense board designs while supporting surface-mount assembly.

Why Choose R9A08G045S13GBG#AC0?

The R9A08G045S13GBG#AC0 positions itself as an integrated solution for embedded and industrial designs that require 64-bit application processing, a dedicated real-time co-processor and a comprehensive hardware security set. Its combination of dual Gigabit Ethernet, USB OTG, modern memory support and industrial temperature qualification makes it suitable for networked and secure embedded systems.

Manufactured by Renesas and delivered in a compact 361-LFBGA surface-mount package, this SoC is designed for engineers seeking a secure, connected and industrially qualified platform for their embedded product lines.

Request a quote or submit an inquiry for R9A08G045S13GBG#AC0 to check pricing and availability for your design needs.

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