R9A08G045S13GBG#AC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 349 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.1GHz | Supplier Device Package | 361-LFBGA (13×13) | ||
| USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S13GBG#AC0 – SOC RZ/G3S 14BGA NON-SECURE 1+1C
The R9A08G045S13GBG#AC0 is a system-on-chip microprocessor from Renesas featuring an ARM® Cortex®-A55 main core running at 1.1 GHz. It integrates a Cortex®-M33 co-processor and on-chip controllers designed for embedded and industrial applications where performance, connectivity and hardware security features are required.
Targeted at industrial and embedded markets, this device provides a compact 361-LFBGA (13×13) surface-mount package, industrial temperature qualification and a set of integrated interfaces for networking and peripheral connectivity.
Key Features
- CPU Core ARM® Cortex®-A55 single 64-bit core at 1.1 GHz, suitable for general-purpose application processing within embedded systems.
- Co-processor ARM® Cortex®-M33 co-processor for real-time control and offload of lower-level tasks.
- Memory Controllers Integrated support for DDR4 and LPDDR4 memories to connect modern external DRAM for system memory.
- High-speed Ethernet Dual 10/100/1000 Mbps Ethernet interfaces for robust wired networking and industrial communications.
- USB Connectivity Two USB 2.0 OTG ports for flexible peripheral and host connections.
- Security Features Hardware security suite including AES, ARM TrustZone, Hash, RSA, Secure Boot and a TRNG to support device integrity and secure operations.
- Package & Mounting 361-LFBGA (13×13) supplier device package designed for surface-mount assembly in space-constrained boards.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
- System Interfaces Built-in DMA and peripheral interfaces to streamline data movement and peripheral integration.
Typical Applications
- Industrial Embedded Systems Control and monitoring systems that require industrial temperature qualification and reliable wired networking.
- Edge Networking & Gateways Networked devices and gateways leveraging dual Gigabit Ethernet and USB OTG for flexible connectivity.
- Secure IoT Endpoints Devices requiring hardware security features such as AES, Secure Boot, RSA and TRNG to protect device integrity and communications.
- Embedded Control & Sensor Hubs Applications that can offload real-time tasks to the Cortex-M33 co-processor while the Cortex-A55 handles higher-level processing.
Unique Advantages
- Balanced processing architecture: Combines a 64-bit Cortex-A55 application core with a Cortex-M33 co-processor to separate application and real-time workloads.
- Integrated connectivity: Dual Gigabit Ethernet and two USB 2.0 OTG ports provide versatile wired networking and peripheral options without external controllers.
- Comprehensive hardware security: On-chip AES, ARM TrustZone, hashing, RSA, Secure Boot and TRNG support secure device identity and trusted boot chains.
- Industrial-ready thermal range: Rated for −40 °C to 85 °C operation to meet environmental requirements of industrial deployments.
- Modern memory support: DDR4 and LPDDR4 memory controller support enables use of current DRAM technologies for performance and capacity.
- Compact BGA packaging: 361-LFBGA (13×13) package provides a small footprint for dense board designs while supporting surface-mount assembly.
Why Choose R9A08G045S13GBG#AC0?
The R9A08G045S13GBG#AC0 positions itself as an integrated solution for embedded and industrial designs that require 64-bit application processing, a dedicated real-time co-processor and a comprehensive hardware security set. Its combination of dual Gigabit Ethernet, USB OTG, modern memory support and industrial temperature qualification makes it suitable for networked and secure embedded systems.
Manufactured by Renesas and delivered in a compact 361-LFBGA surface-mount package, this SoC is designed for engineers seeking a secure, connected and industrially qualified platform for their embedded product lines.
Request a quote or submit an inquiry for R9A08G045S13GBG#AC0 to check pricing and availability for your design needs.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016