R9A08G045S17GBG#AC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 905 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.1GHz | ||
| Supplier Device Package | 361-LFBGA (13×13) | USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S17GBG#AC0 – ARM® Cortex®-A55 1.1 GHz 64‑Bit SoC
The R9A08G045S17GBG#AC0 is a Renesas RZ/G3S microprocessor solution featuring a single ARM® Cortex®-A55 core running at 1.1 GHz. It combines a 64‑bit application core with an ARM® Cortex®-M33 co-processor and a set of integrated interfaces tailored for embedded and industrial designs.
Targeted at embedded and industrial applications, this device offers on-chip security features and flexible memory and connectivity options to support secure networked products deployed across a wide operating temperature range.
Key Features
- Core Single ARM® Cortex®-A55 64‑bit application core running at 1.1 GHz for deterministic application processing.
- Co-processor ARM® Cortex®-M33 co-processor for real-time or auxiliary processing tasks.
- Memory Support Integrated controllers for DDR4 and LPDDR4 memory to support system memory requirements.
- Connectivity Two 10/100/1000 Mbps Ethernet ports and two USB 2.0 OTG ports provide wired networking and peripheral connectivity options.
- Security On-chip security features including AES, ARM TrustZone, Hash, RSA, Secure Boot and a True Random Number Generator (TRNG) for secure boot and cryptographic functions.
- Interfaces & System Includes DMA and other system interfaces to assist high-throughput data movement and peripheral control.
- Package & Mounting 361‑LFBGA package (13 × 13 mm) supplied as a surface-mount device for compact board designs.
- Qualification & Temperature Industrial-qualified device rated for operation from -40 °C to 85 °C.
Typical Applications
- Industrial Control Use in industrial controllers and embedded systems that require an industrial temperature range and on-chip security.
- Secure Gateways Ideal for secure gateway and edge-node designs leveraging dual Gigabit Ethernet and hardware security features for encrypted communications and secure boot.
- Networked Embedded Equipment Applies to networking equipment and appliances needing multiple wired interfaces and DMA-assisted data movement.
- USB-Enabled Embedded Devices Two USB 2.0 OTG ports support connected peripherals and host/device roles in embedded product designs.
Unique Advantages
- Integrated Security Stack: Hardware AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG provide a foundation for secure device deployment and authenticated boot flows.
- Dual Gigabit Ethernet: Two 10/100/1000 Mbps ports enable robust wired networking and redundant or segmented network topologies.
- Flexible Memory Options: Support for DDR4 and LPDDR4 memory controllers lets designers choose memory technologies to match performance and power targets.
- Combined Application and Real-Time Processing: Cortex‑A55 application core plus Cortex‑M33 co-processor allows separation of application-level tasks and real-time control functions.
- Industrial Operating Range: Rated for -40 °C to 85 °C to meet the environmental requirements of industrial deployments.
- Compact Surface-Mount Package: 361‑LFBGA (13×13) package supports high-density PCB layouts while maintaining a standardized footprint.
Why Choose R9A08G045S17GBG#AC0?
The R9A08G045S17GBG#AC0 delivers a balanced combination of application processing, real-time co-processing, security and wired connectivity in a compact, industrial-qualified package. As part of the Renesas R9A08G045 series, it is suited for embedded and industrial designs that require secure network connectivity, memory flexibility and predictable thermal performance.
This device is appropriate for engineers building secure gateways, industrial controllers, and networked embedded equipment who need integrated security primitives, dual gigabit Ethernet and standard memory interfaces in a surface-mount 361‑LFBGA package.
Request a quote or submit an inquiry to receive pricing, availability and technical ordering information for the R9A08G045S17GBG#AC0. Our team can provide details to support your design and procurement needs.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016