R9A08G045S37GBG#AC0

SOC RZ/G3S 14BGA SECURE 1+2CPU(B
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 751 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.1GHz
Supplier Device Package361-LFBGA (13×13)USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S37GBG#AC0 – SOC RZ/G3S 14BGA SECURE 1+2CPU(B

The R9A08G045S37GBG#AC0 is an SoC-class microprocessor in the Renesas RZ/G3S family that integrates a single ARM® Cortex®-A55 64‑bit core running at 1.1 GHz with an ARM® Cortex®-M33 co-processor. Designed for embedded applications, it combines performance, on-chip security features and multiple connectivity options for industrial and connected-edge use cases.

This device provides memory controller support for DDR4 and LPDDR4, dual Gigabit Ethernet ports and dual USB 2.0 OTG interfaces, packaged in a 361‑LFBGA (13×13) surface-mount package and specified for industrial temperature operation.

Key Features

  • Core Processor — Single ARM® Cortex®-A55 64‑bit core at 1.1 GHz, providing general-purpose application processing for embedded workloads.
  • Co-Processor — Integrated ARM® Cortex®-M33 co-processor for offloading real-time or control tasks.
  • Memory — On-chip controllers for DDR4 and LPDDR4 memory technologies to support high-bandwidth system memory configurations.
  • Connectivity — Two 10/100/1000 Mbps Ethernet ports and two USB 2.0 OTG interfaces for wired networking and peripheral connectivity.
  • Security — Hardware security features including AES, ARM TrustZone, hash, RSA, secure boot and a TRNG to enable authenticated and encrypted systems.
  • Package & Mounting — 361‑LFBGA (13×13) supplier device package with surface-mount assembly for compact board designs.
  • Qualification & Temperature — Industrial qualification with operating temperature range from −40 °C to 85 °C for deployment in demanding environments.
  • System Integration — On-chip DMA for efficient data movement; graphics acceleration is not included.

Typical Applications

  • Industrial Control — Industrial-grade temperature range and secure boot features make this SoC suitable for embedded controllers and automation nodes requiring secure processing.
  • Secure Edge Devices — Hardware AES, RSA, TrustZone and TRNG support secure data handling and device authentication at the network edge.
  • Networked Embedded Gateways — Dual Gigabit Ethernet and dual USB 2.0 OTG interfaces enable wired connectivity and peripheral integration for gateway and bridging applications.
  • Connected Instrumentation — DDR4/LPDDR4 memory support and an ARM® Cortex®-M33 co-processor help balance application performance and real-time instrumentation tasks.

Unique Advantages

  • Balanced Performance and Control: A 1.1 GHz ARM® Cortex®-A55 core paired with an ARM® Cortex®-M33 co-processor separates application and real-time tasks for predictable system behavior.
  • Integrated Security Suite: AES, RSA, hashing, TrustZone, secure boot and a TRNG provide hardware roots of trust that simplify secure system design.
  • Flexible Memory Support: DDR4 and LPDDR4 controller support enables scalable memory configurations to match performance and cost targets.
  • Robust Connectivity: Dual Gigabit Ethernet ports plus dual USB 2.0 OTG interfaces deliver multiple options for wired networking and peripheral attachment.
  • Industrial Readiness: Industrial qualification and −40 °C to 85 °C operating range support deployment in temperature-demanding embedded environments.
  • Compact Package: 361‑LFBGA (13×13) package profile supports space-constrained PCB designs while providing a high pin count for system signals.

Why Choose R9A08G045S37GBG#AC0?

The R9A08G045S37GBG#AC0 positions itself as a secure, connected SoC for embedded and industrial designs that need a 64‑bit application core paired with a real-time co-processor. Its combination of DDR4/LPDDR4 memory support, dual Gigabit Ethernet, dual USB OTG and a comprehensive hardware security feature set enables compact, networked systems with a focus on authenticated and encrypted operation.

This Renesas device is suited to designers building industrial controllers, secure edge gateways and networked instrumentation where industrial temperature operation and integrated security are required. The package and interfaces allow straightforward integration into compact, surface-mount board designs.

Request a quote or submit an inquiry to get pricing and availability for R9A08G045S37GBG#AC0 for your next embedded or industrial project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up