R9A09G011GBG#BCC
| Part Description |
ARM® Cortex®-A53 Microprocessor IC RZ/V 2 Core, 64-Bit 996MHz 841-FBGA (15x15) |
|---|---|
| Quantity | 1,773 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G011 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | N/A | Ethernet | GbE (1) | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 841-FBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARC4, RSA, SHA-224, SHA-256, TRNG | ||
| Speed | 996MHz | Supplier Device Package | 841-FBGA (15×15) | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A09G011GBG#BCC – IC MPU RZ/V 996MHz 841-FBGA
The R9A09G011GBG#BCC is a microprocessor IC in the RZ/V family featuring a dual-core ARM® Cortex®-A53 64-bit architecture running at 996 MHz. Designed for embedded and industrial applications, it combines compute performance with integrated multimedia and security functions.
With LPDDR4 memory support, multiple display interfaces and a broad operating temperature range, this device targets industrial embedded systems that require robust performance, connectivity and hardware security.
Key Features
- Core & Performance Dual ARM® Cortex®-A53 cores, 64-bit, operating at 996 MHz to support general-purpose embedded compute tasks.
- Memory LPDDR4 memory controller support to enable higher memory bandwidth for data- and frame-buffer intensive applications.
- Multimedia Acceleration Multimedia co-processor support including NEON™ SIMD to accelerate signal processing and media workloads.
- Display Interfaces Integrated display controllers for DisplayPort (DP), HDMI and LCD panels to drive a range of modern displays.
- Connectivity One Gigabit Ethernet interface and one USB 3.1 port for high-speed network and peripheral connectivity; additional camera interface (CSI) for image input.
- Security Hardware security features including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG) for cryptographic operations and secure key generation.
- Package & Mounting Supplied in an 841‑FBGA package (15 × 15 mm), surface-mount package suitable for compact embedded assemblies.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 125 °C for deployment in demanding environments.
Typical Applications
- Industrial Embedded Systems Use in industrial controllers and HMI platforms that require sustained operation across −40 °C to 125 °C with integrated networking and display support.
- Networked Devices Integration into connected appliances and gateways leveraging the Gigabit Ethernet and USB 3.1 interfaces for high-speed data transfer.
- Multimedia Displays Driving DP, HDMI or LCD panels in embedded display applications where on-chip display controllers and NEON SIMD assist media processing.
- Machine Vision and Camera Systems Camera interface (CSI) support enables use in vision modules that benefit from on-chip compute and multimedia acceleration.
Unique Advantages
- Balanced Dual-Core 64‑Bit Processing: Two ARM® Cortex®-A53 cores at 996 MHz provide a balance of performance and efficiency for multitasking embedded workloads.
- Integrated Display & Camera Interfaces: On-chip DP, HDMI, LCD and CSI reduce external component count for display and vision systems, simplifying BOM and board design.
- Hardware Security Suite: AES, RSA, SHA-224/256 and TRNG hardware accelerators help offload cryptographic workloads and improve secure element capabilities.
- Industrial Temperature Capability: Rated for −40 °C to 125 °C, enabling deployment in harsh industrial environments without additional thermal derating.
- High-Speed Connectivity: Gigabit Ethernet and USB 3.1 support enable fast networked and peripheral data paths for connected embedded applications.
- Compact FBGA Package: The 841-FBGA (15×15 mm) package delivers a compact footprint suited to space-constrained designs.
Why Choose R9A09G011GBG#BCC?
The R9A09G011GBG#BCC positions itself as a purpose-built embedded microprocessor combining dual-core ARM® Cortex®-A53 performance with a rich set of I/O, display and security features. Its LPDDR4 memory support, multimedia acceleration and high-speed connectivity make it well suited for industrial embedded designs that need integrated display, vision and network capabilities.
Backed by Renesas, this module offers a compact 841‑FBGA footprint and industrial temperature qualification, delivering long-term robustness and a streamlined integration path for developers focused on industrial, networked and multimedia embedded products.
Request a quote or submit an inquiry to receive pricing and availability for R9A09G011GBG#BCC and to discuss how this MPU can fit your embedded design requirements.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016