R9A09G057H41GBG#AC0
| Part Description |
RZ/V2H CA55 QUAD 19MM BULK |
|---|---|
| Quantity | 1,144 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H41GBG#AC0 – RZ/V2H CA55 QUAD 19MM BULK
The R9A09G057H41GBG#AC0 is a microprocessor IC in the R9A09G057 series designed for embedded and industrial applications. It integrates an ARM® Cortex®-A53 core architecture with a 1.8 GHz clock and a 2-core, 64-bit configuration, providing a balanced platform for compute and multimedia workloads.
Targeted at industrial-grade designs, the device combines display and high-speed I/O options with on-chip security and LPDDR4 memory support, delivering a compact, RoHS-compliant solution in an 841-FBGA (15×15) package rated for -40 °C to 125 °C operation.
Key Features
- Core and Performance — ARM® Cortex®-A53 architecture, dual-core 64-bit configuration running at up to 1.8 GHz for general embedded processing and multimedia tasks.
- Co-Processing and SIMD — Multimedia co-processor with NEON™ SIMD to accelerate media and signal processing workloads.
- Memory Support — LPDDR4 RAM controller support for high-bandwidth system memory interfacing.
- Display Interfaces — Integrated display controllers for DP, HDMI and LCD to support a range of visual output options.
- Connectivity — Single GbE port and one USB 3.1 port for wired networking and high-speed peripheral connectivity.
- Security Features — Hardware-supported cryptography including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG) to support secure boot and data protection schemes.
- Industrial Qualification & Temperature Range — Qualified for industrial applications with an operating temperature range of -40 °C to 125 °C.
- Package and Mounting — 841-FBGA (15×15) supplier device package, surface-mount mounting for compact board-level integration.
- Regulatory Compliance — RoHS compliant for environmental regulatory adherence.
Unique Advantages
- Balanced compute and multimedia: ARM Cortex‑A53 dual-core at 1.8 GHz with NEON SIMD supports both control-plane and media-processing tasks without separate processors.
- Integrated display options: Native DP, HDMI and LCD controllers reduce external bridge requirements for visual interfaces.
- On-chip security primitives: AES, RSA, SHA and TRNG enable hardware-rooted cryptographic capabilities to simplify secure system design.
- Industrial-grade operation: -40 °C to 125 °C rating and industrial qualification support deployment in demanding environments.
- Compact system footprint: 841-FBGA (15×15) surface-mount package helps minimize board area for space-constrained embedded designs.
- High-speed I/O: GbE and USB 3.1 interfaces provide essential connectivity for networking and peripherals with minimal external components.
Why Choose R9A09G057H41GBG#AC0?
The R9A09G057H41GBG#AC0 positions itself as an integrated microprocessor solution for industrial embedded designs that require a mix of general-purpose processing, multimedia capability, and hardware security. With LPDDR4 memory support, native display controllers, GbE and USB 3.1 connectivity, it is suited to applications that need consolidated functionality in a compact, robust package.
Designed for long-term deployment in harsh environments, the device’s industrial qualification, extended temperature range, and RoHS compliance make it appropriate for engineering teams seeking a reliable, well-specified component for embedded platforms where space, security and interface integration matter.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016