R9A09G057H42GBG#BC0
| Part Description |
Microprocessor IC, ARM® Cortex®-A53 |
|---|---|
| Quantity | 520 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H42GBG#BC0 – Microprocessor IC, ARM® Cortex®-A53
The R9A09G057H42GBG#BC0 is a microprocessor IC in the R9A09G057 series from Renesas, built around an ARM® Cortex®-A53 core. Operating at up to 1.8 GHz with a 2-core, 64-bit configuration, this device targets industrial embedded applications that require compute performance, multimedia processing and broad I/O integration.
Designed for industrial qualification and extended temperature operation, the device integrates multimedia acceleration and hardware security primitives alongside display and high-speed connectivity options to support demanding embedded designs.
Key Features
- Core & Performance — ARM® Cortex®-A53 architecture running up to 1.8 GHz in a 2-core, 64-bit configuration for general-purpose embedded compute.
- Multimedia Acceleration — On-chip multimedia and NEON™ SIMD support to accelerate media processing and vector workloads.
- Memory — Integrated LPDDR4 memory controller support for high-bandwidth system memory.
- Display Interfaces — Native display output support including DisplayPort (DP), HDMI and LCD controllers for visual and HMI applications.
- Networking & USB — Single Gigabit Ethernet (GbE) port and one USB 3.1 interface for high-speed connectivity and peripheral attachment.
- Security — Hardware security features including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG) for secure boot, encryption and integrity functions.
- Industrial Qualification & Temperature — Industrial qualification with an operating temperature range of −40 °C to 125 °C for deployment in harsh environments.
- Package & Mounting — Supplied in an 841-FBGA (15 × 15 mm) surface-mount package for compact board-level integration.
- Regulatory — RoHS-compliant construction.
Typical Applications
- Industrial Embedded Systems — Compute and control tasks in industrial equipment where extended temperature range and industrial qualification are required.
- Multimedia & Display Systems — HMI and visualization platforms leveraging DP, HDMI and LCD controller support for user interfaces and displays.
- Secure Networked Devices — Devices requiring wired networking and onboard security primitives for encrypted communications and data protection.
- High‑Performance Peripherals — Systems that use high-speed USB 3.1 connectivity for external peripherals and data transfer.
Unique Advantages
- Balanced compute and multimedia: 1.8 GHz ARM® Cortex®-A53 cores with NEON™ SIMD deliver general-purpose processing plus media acceleration in one device.
- Comprehensive display I/O: Built-in DP, HDMI and LCD controllers simplify integration of displays and HMIs without additional bridge devices.
- Integrated security primitives: AES, ARC4, RSA, SHA-224/256 and TRNG provide hardware-level building blocks for secure applications.
- Industrial-ready thermal range: −40 °C to 125 °C operation supports deployment in demanding industrial environments.
- High-speed interfaces: GbE and USB 3.1 deliver the connectivity performance required for networked and peripheral-rich designs.
- Compact system footprint: 841-FBGA (15 × 15 mm) package enables a small board area for space-constrained embedded products.
Why Choose R9A09G057H42GBG#BC0?
The R9A09G057H42GBG#BC0 positions itself as a high-performance, industrial-grade microprocessor suitable for embedded designs that need a combination of compute, multimedia and security features. Its ARM® Cortex®-A53 cores, LPDDR4 memory support and integrated display and connectivity options enable concise system designs with fewer external components.
Backed by Renesas and offered in a compact 841-FBGA package with a wide operating temperature range, this device is a practical choice for engineers developing robust industrial and embedded products that require sustained performance and on-chip security capabilities.
Request a quote or submit an inquiry to start the procurement process for R9A09G057H42GBG#BC0 and discuss availability and pricing information.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016