R9A09G057H45GBG#BC0
| Part Description |
RZ/V2H CA55 QUAD 19MM SECURE FUL |
|---|---|
| Quantity | 1,149 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H45GBG#BC0 – RZ/V2H CA55 QUAD 19MM SECURE FUL
The R9A09G057H45GBG#BC0 is a microprocessor IC in the R9A09G057 series designed for embedded and industrial applications. It implements ARM® Cortex®-A53 CPU cores and provides a balance of compute performance and integrated I/O for multimedia and secure embedded systems.
With a 1.8 GHz core frequency, LPDDR4 memory support, multiple display interfaces and on-chip security primitives, this device targets industrial embedded designs requiring processing power, display connectivity and hardware security within an extended temperature range.
Key Features
- CPU Core and Performance — ARM® Cortex®-A53 architecture with a 1.8 GHz clock rate and a 2-core, 64-bit configuration for general-purpose embedded processing.
- Co-processors & SIMD — Multimedia co-processor and NEON™ SIMD acceleration to assist media processing and compute-intensive signal operations.
- Memory Support — LPDDR4 RAM controller support for high-bandwidth system memory.
- Display Interfaces — Integrated controllers for DisplayPort (DP), HDMI and LCD panels to support advanced HMI and multimedia displays.
- High-speed I/O — Single GbE interface and USB 3.1 port for networking and high-throughput peripheral connectivity.
- Security Features — Hardware-implemented AES, ARC4, RSA, SHA-224, SHA-256 and TRNG for cryptographic functions and entropy generation.
- Package & Mounting — Supplied in an 841-FBGA package (15×15 mm) for surface-mount PCB assembly.
- Industrial Qualification & Temperature Range — Qualified for industrial use with an operating temperature range of −40°C to 125°C for deployment in harsh environments.
- Compliance — RoHS-compliant manufacturing and materials.
Typical Applications
- Industrial Embedded Systems — Processing and control in industrial equipment where extended temperature range and industrial qualification are required.
- Multimedia and Display Solutions — HMI panels, digital signage and media appliances leveraging DP/HDMI/LCD controllers and NEON SIMD for media tasks.
- Secure Edge Devices — Edge appliances and gateways that require onboard cryptographic functions (AES, RSA, SHA) and a TRNG for secure key generation.
- Networked Embedded Appliances — Devices needing GbE and high-speed USB connectivity for data transfer and peripheral integration.
Unique Advantages
- Balanced Compute and Multimedia — 1.8 GHz ARM® Cortex®-A53 cores paired with multimedia co-processing and NEON SIMD for a mix of general-purpose and media workloads.
- Integrated Display Support — Native DP, HDMI and LCD controllers reduce external component count for display-centric designs.
- On-chip Security — Multiple hardware cryptography primitives and a TRNG enable secure boot, encryption and authentication without relying solely on external security ICs.
- Industrial-Grade Operating Range — −40°C to 125°C operating temperature supports deployment in demanding environmental conditions.
- Compact High-density Package — 841-FBGA (15×15) package enables a compact board footprint while providing extensive functionality.
- Standards-aligned I/O — GbE and USB 3.1 interfaces provide standard high-speed connectivity for networking and peripherals.
Why Choose R9A09G057H45GBG#BC0?
The R9A09G057H45GBG#BC0 positions itself as a robust, industrially qualified microprocessor option for embedded designs that require a combination of compute performance, multimedia capabilities and hardware security. Its ARM® Cortex®-A53 cores, LPDDR4 support and hardware cryptography features provide a capability set suited to secure edge computing, HMI and networked appliances.
Designed for engineers building industrial and embedded systems, this device delivers long-term value through integrated interfaces, rugged operating range and a compact FBGA package—helping simplify system design and reduce external component requirements.
Request a quote or submit an inquiry to obtain pricing, lead-time information and sample availability for the R9A09G057H45GBG#BC0.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016