R9A09G057H48GBG#AC0
| Part Description |
RZ/V2H CA55 QUAD ISP&GPU SECURE1 |
|---|---|
| Quantity | 615 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H48GBG#AC0 – RZ/V2H CA55 QUAD ISP&GPU SECURE1
The R9A09G057H48GBG#AC0 is a microprocessor IC from Renesas' R9A09G057 series designed for embedded and industrial applications. It features an ARM® Cortex®-A53 core architecture operating up to 1.8 GHz and a 2‑core, 64‑bit configuration.
Engineered for connected, display‑centric embedded systems, this industrial‑qualified device combines multimedia processing, secure cryptography, and a broad set of I/O to support imaging, display and networked use cases across harsh operating environments.
Key Features
- CPU ARM® Cortex®‑A53 cores with a 2‑core, 64‑bit configuration running up to 1.8 GHz, delivering compute capacity for embedded applications.
- Multimedia & DSP Integrated multimedia co‑processors and NEON™ SIMD provide acceleration for media processing and signal workloads.
- Memory Support LPDDR4 memory controller for modern, high‑bandwidth system memory interface.
- Display Interfaces Supports DP, HDMI and LCD display interfaces to drive a variety of human‑machine interfaces and display panels.
- Connectivity Includes one Gigabit Ethernet port (GbE) and one USB 3.1 port for high‑speed wired networking and peripheral connectivity.
- Security Hardware security features include AES, ARC4, RSA, SHA‑224, SHA‑256 and a TRNG to support encrypted storage and secure boot scenarios.
- Package & Mounting 841‑FBGA supplier device package (15×15) with surface mount compatibility for compact board designs.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 125 °C for robust field deployment.
- Compliance RoHS compliant, meeting common environmental requirements for electronic components.
Typical Applications
- Industrial Control & Automation Use the device for embedded controllers and operator panels where industrial temperature range and secure connectivity are required.
- Human‑Machine Interfaces (HMI) DP, HDMI and LCD support combined with LPDDR4 memory and multimedia acceleration make it suitable for rich graphical displays and touch panels.
- Imaging & Video Systems Named for ISP and GPU capabilities, it fits image processing and video playback/streaming applications needing on‑board multimedia processing and security.
- Networked Embedded Devices GbE and USB 3.1 interfaces enable high‑speed data transfer and peripheral connectivity for edge devices and appliances.
Unique Advantages
- Integrated Multimedia Acceleration: NEON SIMD and multimedia co‑processors reduce external accelerator requirements and simplify multimedia system design.
- Comprehensive Security Suite: On‑chip AES, ARC4, RSA, SHA‑224, SHA‑256 and TRNG support secure communications, authentication and cryptographic functions in hardware.
- Industrial‑Grade Thermal Range: −40 °C to 125 °C operating range supports deployment in demanding industrial environments.
- Versatile Display & I/O: Multiple display interfaces plus GbE and USB 3.1 provide flexible options for HMI, video and networked applications.
- Compact, SMT‑Ready Package: 841‑FBGA (15×15) package supports space‑constrained board layouts while enabling surface‑mount assembly.
- Standards‑Oriented Memory Interface: LPDDR4 controller enables high bandwidth system memory for responsive multimedia and data processing.
Why Choose R9A09G057H48GBG#AC0?
The R9A09G057H48GBG#AC0 positions itself as a capable, industrial‑qualified microprocessor for embedded systems that demand multimedia processing, secure cryptography and robust connectivity. Its ARM® Cortex®‑A53 2‑core, 64‑bit architecture at up to 1.8 GHz, combined with LPDDR4 support and dedicated multimedia/NEON acceleration, provides a balanced platform for display‑centric and imaging applications.
Manufactured by Renesas and delivered in an 841‑FBGA (15×15) surface‑mount package, this device is suited to designs requiring industrial temperature performance, hardware security primitives and multiple high‑speed interfaces. It offers system designers a focused set of capabilities for scalable, long‑lived embedded products.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
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